IRF2807S International Rectifier, IRF2807S Datasheet

MOSFET N-CH 75V 82A D2PAK

IRF2807S

Manufacturer Part Number
IRF2807S
Description
MOSFET N-CH 75V 82A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF2807S

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
13 mOhm @ 43A, 10V
Drain To Source Voltage (vdss)
75V
Current - Continuous Drain (id) @ 25° C
82A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
160nC @ 10V
Input Capacitance (ciss) @ Vds
3820pF @ 25V
Power - Max
230W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF2807S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF2807S
Manufacturer:
IR
Quantity:
50
Part Number:
IRF2807S
Manufacturer:
IR
Quantity:
5 220
Part Number:
IRF2807S
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRF2807STRRPBF
Manufacturer:
IR
Quantity:
8 000
Thermal Resistance
l
l
l
l
l
l
Absolute Maximum Ratings
www.irf.com
Description
Advanced HEXFET
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The D
accommodating die sizes up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in any
existing surface mount package. The D
high current applications because of its low internal connection
resistance and can dissipate up to 2.0W in a typical surface
mount application.
The through-hole version (IRF2807L) is available for low-
profile applications.
R
R
I
I
I
P
V
I
E
dv/dt
T
T
D
D
DM
AR
J
STG
D
GS
AR
JC
JA
@ T
@ T
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
2
C
C
C
Pak is a surface mount power package capable of
= 25°C
= 100°C
= 25°C
Junction-to-Case
Junction-to-Ambient (PCB mount)**
Peak Diode Recovery dv/dt
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
®
Power MOSFETs from International
Parameter
Parameter

2

Pak is suitable for
ƒ
GS
GS

@ 10V
@ 10V
G
Typ.
300 (1.6mm from case )
–––
–––
10 lbf•in (1.1N•m)
HEXFET
-55 to + 175
IRF2807S
S
D
D
Max.
82
280
230
± 20
1.5
5.9
2
58
43
23
Pak
IRF2807S
IRF2807L
®
R
Power MOSFET
Max.
DS(on)
0.65
V
40
I
D
DSS
= 82A‡
IRF2807L
TO-262
PD - 94170
= 75V
= 13m
Units
Units
°C/W
W/°C
V/ns
mJ
°C
W
A
V
A
02/14/02
1

Related parts for IRF2807S

IRF2807S Summary of contents

Page 1

... Typ. ––– ––– 94170 IRF2807S IRF2807L ® HEXFET Power MOSFET 75V DSS R = 13m DS(on 82A‡ Pak TO-262 IRF2807S IRF2807L Max. Units ‡ 280 230 W 1.5 W/°C ± 5.9 V/ns - 175 °C 10 lbf•in (1.1N•m) Max. ...

Page 2

... IRF2807S/IRF2807L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Fig 1. Typical Output Characteristics 1000  ° 175 C 100  V DS 20µs PULSE WIDTH 10 4.0 5.0 6.0 7 Gate-to-Source Voltage (V) GS Fig 3. Typical Transfer Characteristics www.irf.com IRF2807S/IRF2807L  1000 TOP BOTTOM 100 ° 10 0.1 10 100 Fig 2. Typical Output Characteristics 3 2.5 2.0 ° J 1.5 1.0 0.5 = 25V 0 ...

Page 4

... IRF2807S/IRF2807L 7000 0V MHZ C iss = 6000 C rss = oss = 5000 Ciss 4000 3000 Coss 2000 Crss 1000 Drain-to-Source Voltage (V) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 100  ° 175 ° 0.1 0.0 0.4 0.8 1.2 V ,Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode Forward Voltage ...

Page 5

... Fig 9. Maximum Drain Current Vs. Case Temperature 0.50 0.20 0.1 0.10 0.05  SINGLE PULSE 0.02 (THERMAL RESPONSE) 0.01 0.01 0.00001 0.0001 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com IRF2807S/IRF2807L Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 150 175 ° 10 d(on) Fig 10b ...

Page 6

... IRF2807S/IRF2807L Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform 6 600 1 5V 500 400 + - 300 200 100 Starting T , Junction Temperature ( C) Fig 12c. Maximum Avalanche Energy Fig 13b. Gate Charge Test Circuit  I D TOP ...

Page 7

... Reverse Polarity of D.U.T for P-Channel Driver Gate Drive D.U.T. I Reverse Recovery Current D.U.T. V Re-Applied Voltage Inductor Curent *** V Fig 14. For N-channel www.irf.com IRF2807S/IRF2807L Peak Diode Recovery dv/dt Test Circuit + Circuit Layout Considerations * Low Stray Inductance Ground Plane ƒ Low Leakage Inductance Current Transformer - - dv/dt controlled controlled by Duty Factor " ...

Page 8

... IRF2807S/IRF2807L 2 D Pak Package Outline 1 0.54 (.415 ) 1 0.29 (.405 ) 1.4 0 (.055 ) - AX. 2 1 5.49 (.6 10) 1 4.73 (.5 80 1.40 (.0 55) 3X 1.14 (.0 45) 0 0 .08 (.20 0) 0.25 (. FTER & 4. TRO L LIN ATSINK & SIO Pak Part Marking Information TIO (. (.16 5) 1 ...

Page 9

... TO-262 Package Outline TO-262 Part Marking Information www.irf.com IRF2807S/IRF2807L 9 ...

Page 10

... IRF2807S/IRF2807L 2 D Pak Tape & Reel Information TIO . -418 . LIN SIO LIM DIM DIST WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 (. (. (. (. 1 1 .42 (. .22 (. .75 (. 0 .25 (. 0 13.50 (.532 ) 2 7.4 0 (1.079 ) 12.80 (.504 ) 2 3.9 0 (.9 41 ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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