IRF740STRLPBF Vishay, IRF740STRLPBF Datasheet - Page 8

MOSFET N-CH 400V 10A D2PAK

IRF740STRLPBF

Manufacturer Part Number
IRF740STRLPBF
Description
MOSFET N-CH 400V 10A D2PAK
Manufacturer
Vishay
Type
Power MOSFETr
Datasheets

Specifications of IRF740STRLPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
550 mOhm @ 6A, 10V
Drain To Source Voltage (vdss)
400V
Current - Continuous Drain (id) @ 25° C
10A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
63nC @ 10V
Input Capacitance (ciss) @ Vds
1400pF @ 25V
Power - Max
3.1W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Transistor Polarity
N Channel
Continuous Drain Current Id
10A
Drain Source Voltage Vds
400V
On Resistance Rds(on)
550mohm
Rds(on) Test Voltage Vgs
10V
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Configuration
Single
Resistance Drain-source Rds (on)
0.55 Ohms
Drain-source Breakdown Voltage
400 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
10 A
Power Dissipation
3.1 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.55Ohm
Drain-source On-volt
400V
Gate-source Voltage (max)
±20V
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
2 +Tab
Package Type
D2PAK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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TO-263AB (HIGH VOLTAGE)
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimensions are shown in millimeters (inches).
3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the
4. Thermal PAD contour optional within dimension E, L1, D1 and E1.
5. Dimension b1 and c1 apply to base metal only.
6. Datum A and B to be determined at datum plane H.
7. Outline conforms to JEDEC outline to TO-263AB.
Document Number: 91364
Revision: 15-Sep-08
ECN: S-82110-Rev. A, 15-Sep-08
DWG: 5970
outmost extremes of the plastic body at datum A.
DIM.
A1
b1
b2
b3
c1
c2
A
D
b
c
4
(Datum A)
MIN.
4.06
0.00
0.51
0.51
1.14
1.14
0.38
0.38
1.14
8.38
L1
L2
D
MILLIMETERS
B
B
2 x e
Lead tip
1
3
B
B
MAX.
4
4.83
0.25
0.99
0.89
1.78
1.73
0.74
0.58
1.65
9.65
E
2
C
4
3
C
2 x b
2 x b2
0.010
A
0.160
0.000
0.020
0.020
0.045
0.045
0.015
0.015
0.045
0.330
H
MIN.
5
M
INCHES
A
Plating
M
(c)
B
Section B - B and C - C
Detail A
MAX.
0.190
0.010
0.039
0.035
0.070
0.068
0.029
0.023
0.065
0.380
Scale: none
b1, b3
(b, b2)
5
± 0.004
c
A
c1
c2
Base
metal
M
B
5
B
A
A
DIM.
D1
E1
L1
L2
L3
L4
H
E
e
L
0° to 8°
L3
Gauge
plane
14.61
MIN.
6.86
9.65
6.22
1.78
4.78
MILLIMETERS
-
-
Package Information
2.54 BSC
0.25 BSC
Rotated 90° CW
L
View A - A
scale 8:1
Detail “A”
L4
E1
E
MAX.
10.67
15.88
2.79
1.65
1.78
5.28
-
-
D1
Vishay Siliconix
4
H
A1
4
0.270
0.380
0.245
0.575
0.070
0.188
MIN.
B
-
-
0.100 BSC
0.010 BSC
Seating plane
INCHES
www.vishay.com
MAX.
0.420
0.625
0.110
0.066
0.070
0.208
-
-
1

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