IRF530NSTRLPBF International Rectifier, IRF530NSTRLPBF Datasheet - Page 2

MOSFET N-CH 100V 17A D2PAK

IRF530NSTRLPBF

Manufacturer Part Number
IRF530NSTRLPBF
Description
MOSFET N-CH 100V 17A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF530NSTRLPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
90 mOhm @ 9A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
17A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
37nC @ 10V
Input Capacitance (ciss) @ Vds
920pF @ 25V
Power - Max
3.8W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
17 A
Power Dissipation
3.8 W
Mounting Style
SMD/SMT
Gate Charge Qg
24.7 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IRF530NSTRLPBF
IRF530NSTRLPBFTR

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Source-Drain Ratings and Characteristics
Electrical Characteristics @ T

ƒ
Notes:
V
∆V
R
V
g
I
I
Q
Q
Q
t
t
t
t
C
C
C
E
L
L
I
I
V
t
Q
t
DSS
GSS
SM
d(on)
r
d(off)
f
S
rr
on
2
fs
D
S
(BR)DSS
GS(th)
AS
SD
DS(on)
g
gs
gd
iss
oss
rss
rr
Repetitive rating; pulse width limited by
Pulse width ≤ 400µs; duty cycle ≤ 2%.
I
T
(BR)DSS
R
max. junction temperature. (See fig. 11)
Starting T
SD
J
G
≤ 175°C
≤ 9.0A di/d ≤ 410A/µs, V
= 25Ω, I
/∆T
J
J
Drain-to-Source Leakage Current
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Single Pulse Avalanche Energy
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Internal Drain Inductance
Internal Source Inductance
= 25°C, L = 2.3mH
AS
= 9.0A, V
GS

Parameter
Parameter
=10V (See Figure 12)
DD
≤ V
(BR)DSS
J
,
= 25°C (unless otherwise specified)
‚‡
**When mounted on 1" square PCB (FR-4 or G-10 Material). For
recommended footprint and soldering techniques refer to
application note #AN-994
100
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
––– 340… 93†
–––
Min. Typ. Max. Units
2.0
Min. Typ. Max. Units
12
–––
–––
–––
–––
–––
–––
This is a typical value at device destruction and represents
This is a calculated value limited to T
Uses IRF530N data and test conditions.
operation outside rated limits.
Intrinsic turn-on time is negligible (turn-on is dominated by L
0.11
–––
–––
–––
–––
–––
–––
–––
––– -100
–––
–––
–––
920
130
320
–––
–––
–––
9.2
19
22
35
25
93
–––
–––
–––
–––
250
100
–––
–––
–––
–––
–––
–––
–––
–––
140
480
4.0
7.2
1.3
90
25
37
11
17
60
V/°C
mΩ
µA
nA
nC
ns
nH
mJ
nC
pF
ns
V
V
S
V
V
Reference to 25°C, I
V
V
V
V
V
V
V
I
V
V
V
I
R
V
Between lead,
6mm (0.25in.)
from package
and center of die contact
V
V
ƒ = 1.0MHz, See Fig. 5
I
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs
D
D
AS
GS
GS
DS
DS
DS
DS
GS
GS
DS
GS
DD
GS
GS
DS
J
J
G
= 9.0A
= 9.0A
= 25°C, I
= 25°C, I
= 9.0A, L = 2.3mH
= 12Ω
= 0V, I
= 10V, I
= V
= 50V, I
= 100V, V
= 80V, V
= 20V
= -20V
= 80V
= 10V, See Fig. 6 and 13
= 50V
= 10V, See Fig. 10
= 0V
= 25V
GS
, I
D
J
S
F
D
D
D
Conditions
= 175°C .
= 250µA
Conditions
GS
= 9.0A
= 9.0A, V
= 9.0A
= 250µA
= 9.0A
GS
„‡
= 0V, T
= 0V
D
www.irf.com
„‡
= 1mA
GS
J
„‡
= 150°C
G
= 0V
G
S
+L
D
S
D
)
S
D

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