BAV102,115 NXP Semiconductors, BAV102,115 Datasheet - Page 7

• Manufacturer Part Number: BAV102,115
• Description: DIODE SW G-P 200V 250MA SOD80C
• Manufacturer: NXP Semiconductors

Specifications of BAV102,115

• Package / Case: LL-34, LLDS, MiniMELF, SOD80C
• Mounting Type: Surface Mount
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 50ns
• Current - Reverse Leakage @ Vr: 100nA @ 150V
• Voltage - Forward (vf) (max) @ If: 1.25V @ 200mA
• Voltage - Dc Reverse (vr) (max): 150V
• Capacitance @ Vr, F: 5pF @ 0V, 1MHz
• Current - Average Rectified (io): 250mA (DC)
• Product: General Purpose Diodes
• Peak Reverse Voltage: 200 V
• Forward Continuous Current: 0.25 A
• Max Surge Current: 9 A
• Configuration: Single
• Recovery Time: 50 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.1 uA
• Operating Temperature Range: + 175 C
• Maximum Operating Temperature: + 175 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 933699350115::BAV102 T/R::BAV102 T/R

NXP Semiconductors
11. Soldering
BAV102_BAV103
Product data sheet
Fig 9.
Fig 10. Wave soldering footprint SOD80C
2.90
Reflow soldering footprint SOD80C
1.70
2.25
1.70
All information provided in this document is subject to legal disclaimers.
1.60
Rev. 4 — 6 August 2010
0.90
(2x)
6.30
4.90
2.70
1.90
4.55
4.30
2.30
Single general-purpose switching diodes
sod080c
BAV102; BAV103
sod080c
Dimensions in mm
solder lands
solder resist
occupied area
Dimensions in mm
solder paste
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
occupied area
tracks
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