BAV102,115 NXP Semiconductors, BAV102,115 Datasheet

DIODE SW G-P 200V 250MA SOD80C

BAV102,115

Manufacturer Part Number
BAV102,115
Description
DIODE SW G-P 200V 250MA SOD80C
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAV102,115

Package / Case
LL-34, LLDS, MiniMELF, SOD80C
Mounting Type
Surface Mount
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
50ns
Current - Reverse Leakage @ Vr
100nA @ 150V
Voltage - Forward (vf) (max) @ If
1.25V @ 200mA
Voltage - Dc Reverse (vr) (max)
150V
Capacitance @ Vr, F
5pF @ 0V, 1MHz
Current - Average Rectified (io)
250mA (DC)
Product
General Purpose Diodes
Peak Reverse Voltage
200 V
Forward Continuous Current
0.25 A
Max Surge Current
9 A
Configuration
Single
Recovery Time
50 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.1 uA
Operating Temperature Range
+ 175 C
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
933699350115::BAV102 T/R::BAV102 T/R
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Single general-purpose switching diodes, fabricated in planar technology, and
encapsulated in small hermetically sealed glass SOD80C Surface-Mounted
Device (SMD) packages.
Table 1.
Table 2.
[1]
[2]
[3]
Type number
BAV102
BAV103
Symbol
I
V
t
F
rr
R
BAV102; BAV103
Single general-purpose switching diodes
Rev. 4 — 6 August 2010
High switching speed: t
Low leakage current
High-speed switching
General-purpose switching
Pulse test: t
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
When switched from I
Parameter
forward current
reverse voltage
reverse recovery time
Product overview
Quick reference data
BAV102
BAV103
p
≤ 300 μs; δ ≤ 0.02.
F
Package
NXP
SOD80C
= 30 mA to I
rr
≤ 50 ns
R
= 30 mA; R
Conditions
L
= 100 Ω; measured at I
JEITA
-
Low capacitance: C
Small hermetically sealed glass
SMD package
Voltage clamping
Reverse polarity protection
[1][2]
[3]
Min
-
-
-
-
R
= 3 mA.
Product data sheet
Configuration
single
d
≤ 5 pF
Typ
-
-
-
-
Max
250
150
200
50
Unit
mA
V
V
ns

Related parts for BAV102,115

BAV102,115 Summary of contents

Page 1

BAV102; BAV103 Single general-purpose switching diodes Rev. 4 — 6 August 2010 1. Product profile 1.1 General description Single general-purpose switching diodes, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages. Table 1. ...

Page 2

... NXP Semiconductors 2. Pinning information Table 3. Pin 1 2 [1] The marking band indicates the cathode. 3. Ordering information Table 4. Type number BAV102 BAV103 4. Marking Table 5. Type number BAV102 BAV103 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V RRM ...

Page 3

... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Pulse test: t [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint °C prior to surge. [ Thermal characteristics Table 7. Symbol R th(j-a) R th(j-t) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...

Page 4

... NXP Semiconductors 600 I F (mA) 400 (1) 200 150 °C; typical values (1) T amb = 25 °C; typical values (2) T amb = 25 °C; maximum values (3) T amb Fig 1. Forward current as a function of forward voltage (μ −1 10 − 100 Rmax Solid line: maximum values Dotted line: typical values Fig 3 ...

Page 5

... NXP Semiconductors 300 I F (mA) 200 100 0 0 100 FR4 PCB, standard footprint Fig 5. Forward current as a function of ambient temperature; derating curve 8. Test information D.U. Ω × ( Fig 7. Reverse recovery time test circuit and waveforms BAV102_BAV103 Product data sheet mbh278 300 V R (V) ...

Page 6

... NXP Semiconductors 9. Package outline Fig 8. 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BAV102 BAV103 [1] For further information and the availability of packing methods, see BAV102_BAV103 Product data sheet 0.3 3.7 3.3 ...

Page 7

... NXP Semiconductors 11. Soldering Fig 9. 2.90 Fig 10. Wave soldering footprint SOD80C BAV102_BAV103 Product data sheet 4.55 4.30 2.30 2.25 1.70 1.60 0.90 (2x) Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 1.70 All information provided in this document is subject to legal disclaimers. Rev. 4 — 6 August 2010 BAV102 ...

Page 8

... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date BAV102_BAV103 v.4 20100806 • Modifications: Section 4 • Section 13 “Legal BAV102_BAV103_3 20070816 BAV100_2 19960917 BAV100_1 19960423 BAV102_BAV103 Product data sheet Single general-purpose switching diodes Data sheet status Product data sheet “Marking”: updated information” ...

Page 9

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 10

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 11

... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering ...

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