BAS85,115 NXP Semiconductors, BAS85,115 Datasheet

DIODE SCHOTTKY 30V 200MA SOD80C

BAS85,115

Manufacturer Part Number
BAS85,115
Description
DIODE SCHOTTKY 30V 200MA SOD80C
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS85,115

Package / Case
LL-34, LLDS, MiniMELF, SOD80C
Voltage - Forward (vf) (max) @ If
800mV @ 100mA
Voltage - Dc Reverse (vr) (max)
30V
Current - Average Rectified (io)
200mA (DC)
Current - Reverse Leakage @ Vr
2.3µA @ 25V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Capacitance @ Vr, F
10pF @ 1V, 1MHz
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
30 V
Forward Continuous Current
0.2 A
Max Surge Current
5 A
Configuration
Single
Forward Voltage Drop
0.8 V @ 0.1 A
Maximum Reverse Leakage Current
2.3 uA @ 25 V
Operating Temperature Range
+ 125 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-1609-2
933876540115
BAS85 T/R
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Planar Schottky barrier diode with an integrated guard ring for stress protection,
encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted
Device SMD package with tin-plated metal discs at each end. It is suitable for
“automatic placement” and as such it can withstand immersion soldering.
Table 1.
Symbol
I
V
V
F
R
F
BAS85
Schottky barrier diode
Rev. 6 — 10 September 2010
Low forward voltage
High breakdown voltage
Guard-ring protected
Hermetically sealed glass SMD package
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diodes
Quick reference data
Parameter
forward current
reverse voltage
forward voltage
Conditions
I
F
= 100 mA
Min
-
-
-
Typ
-
-
-
Product data sheet
Max
200
30
800
mA
V
Unit
mV

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BAS85,115 Summary of contents

Page 1

BAS85 Schottky barrier diode Rev. 6 — 10 September 2010 1. Product profile 1.1 General description Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device SMD package ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking band indicates the cathode. 3. Ordering information Table 3. Type number Package BAS85 4. Marking Table 4. Type number BAS85 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol F(AV) I FRM ...

Page 3

... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table amb Symbol [1] Pulse test: t BAS85 Product data sheet Thermal characteristics Parameter thermal resistance from junction to ambient Characteristics ° C unless otherwise specified. ...

Page 4

... NXP Semiconductors 250 I F(AV) (mA) 200 150 100 FR4 PCB, standard footprint Fig 1. Average forward current as a function of ambient temperature; derating curve (1) (nA ( (3) − °C (1) T amb = 25 °C (2) T amb = −40 °C (3) T amb Fig 3. Reverse current as a function of reverse voltage; typical values ...

Page 5

... NXP Semiconductors 8. Package outline Fig 5. 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description BAS85 [1] For further information and the availability of packing methods, see BAS85 Product data sheet 0.3 3.7 3 ...

Page 6

... NXP Semiconductors 10. Soldering Fig 6. 2.90 Fig 7. BAS85 Product data sheet 4.55 4.30 2.30 2.25 1.70 1.60 0.90 (2x) Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 1.70 Wave soldering footprint SOD80C All information provided in this document is subject to legal disclaimers. Rev. 6 — 10 September 2010 ...

Page 7

... NXP Semiconductors 11. Revision history Table 9. Revision history Document ID Release date BAS85_6 20100910 • Modifications: Section 4 • Section 12 “Legal BAS85_5 20090325 BAS85_4 20000525 BAS85_3 19961001 BAS85_2 19960320 BAS85 Product data sheet Data sheet status Product data sheet “Marking”: updated information”: updated ...

Page 8

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 9

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 10

... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information . . . . . . . . . . . . . . . . . . . . . 5 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history ...

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