BAS32L,115 NXP Semiconductors, BAS32L,115 Datasheet - Page 7

• Manufacturer Part Number: BAS32L,115
• Description: DIODE SW 75V 200MA HS SOD80C
• Manufacturer: NXP Semiconductors

Specifications of BAS32L,115

• Package / Case: LL-34, LLDS, MiniMELF, SOD80C
• Voltage - Forward (vf) (max) @ If: 1V @ 100mA
• Voltage - Dc Reverse (vr) (max): 75V
• Current - Average Rectified (io): 200mA (DC)
• Current - Reverse Leakage @ Vr: 5µA @ 75V
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4ns
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 4 A
• Configuration: Single
• Recovery Time: 4 ns
• Forward Voltage Drop: 1 V
• Maximum Reverse Leakage Current: 5 uA
• Operating Temperature Range: + 200 C
• Maximum Operating Temperature: + 200 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1601-2; 933913910115; BAS32L T/R

NXP Semiconductors
11. Soldering
BAS32L
Product data sheet
Fig 9.
Fig 10. Wave soldering footprint SOD80C
2.90
Reflow soldering footprint SOD80C
1.70
2.25
1.70
All information provided in this document is subject to legal disclaimers.
1.60
Rev. 7 — 20 January 2011
0.90
(2x)
6.30
4.90
2.70
1.90
4.55
4.30
2.30
sod080c
sod080c
High-speed switching diode
Dimensions in mm
solder lands
solder resist
occupied area
Dimensions in mm
solder paste
© NXP B.V. 2011. All rights reserved.
BAS32L
solder lands
solder resist
occupied area
tracks
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