BAS32L,115 NXP Semiconductors, BAS32L,115 Datasheet

DIODE SW 75V 200MA HS SOD80C

BAS32L,115

Manufacturer Part Number
BAS32L,115
Description
DIODE SW 75V 200MA HS SOD80C
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS32L,115

Package / Case
LL-34, LLDS, MiniMELF, SOD80C
Voltage - Forward (vf) (max) @ If
1V @ 100mA
Voltage - Dc Reverse (vr) (max)
75V
Current - Average Rectified (io)
200mA (DC)
Current - Reverse Leakage @ Vr
5µA @ 75V
Diode Type
Standard
Speed
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
2pF @ 0V, 1MHz
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
0.2 A
Max Surge Current
4 A
Configuration
Single
Recovery Time
4 ns
Forward Voltage Drop
1 V
Maximum Reverse Leakage Current
5 uA
Operating Temperature Range
+ 200 C
Maximum Operating Temperature
+ 200 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1601-2
933913910115
BAS32L T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS32L,115
Manufacturer:
NXP Semiconductors
Quantity:
18 800
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Single high-speed switching diode, fabricated in planar technology, and encapsulated in a
small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package.
Table 1.
[1]
[2]
Symbol
I
I
V
V
t
F
FRM
rr
R
F
BAS32L
High-speed switching diode
Rev. 7 — 20 January 2011
High switching speed: t
Reverse voltage: V
Repetitive peak reverse voltage: V
Repetitive peak forward current: I
Small hermetically sealed glass SMD package
High-speed switching
Reverse polarity protection
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
When switched from I
Quick reference data
Parameter
forward current
repetitive peak forward
current
reverse voltage
forward voltage
reverse recovery time
F
R
= 10 mA to I
≤ 75 V
rr
≤ 4 ns
R
= 10 mA; R
FRM
RRM
Conditions
I
F
= 100 mA
≤ 450 mA
≤ 100 V
L
= 100 Ω; measured at I
[1]
[2]
Min
-
-
-
-
-
R
= 1 mA.
Typ
-
-
-
-
-
Product data sheet
Max
200
450
75
1000
4
V
Unit
mA
mA
mV
ns

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BAS32L,115 Summary of contents

Page 1

BAS32L High-speed switching diode Rev. 7 — 20 January 2011 1. Product profile 1.1 General description Single high-speed switching diode, fabricated in planar technology, and encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package. 1.2 Features and ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking band indicates the cathode. 3. Ordering information Table 3. Type number BAS32L 4. Marking Table 4. Type number BAS32L 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V RRM FRM I FSM ...

Page 3

... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint °C prior to surge. [ Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...

Page 4

... NXP Semiconductors 300 I F (mA) 200 100 0 0 100 FR4 PCB, standard footprint Fig 1. Forward current as a function of ambient temperature; derating curve FSM ( − Based on square wave currents °C prior to surge T j Fig 3. Non-repetitive peak forward current as a function of pulse duration; maximum values ...

Page 5

... NXP Semiconductors = 25 ° MHz Fig 5. Diode capacitance as a function of reverse voltage; typical values 8. Test information D.U.T. I Ω × Input signal: Reverse pulse rise time t Oscilloscope: Rise time Fig 6. Reverse recovery time test circuit and waveforms I 450 Ω 1 kΩ Ω ...

Page 6

... NXP Semiconductors 9. Package outline Fig 8. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAS32L [1] For further information and the availability of packing methods, see BAS32L Product data sheet 0.3 3.7 3.3 ...

Page 7

... NXP Semiconductors 11. Soldering Fig 9. 2.90 Fig 10. Wave soldering footprint SOD80C BAS32L Product data sheet 4.55 4.30 2.30 2.25 1.70 1.60 0.90 (2x) Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 1.70 All information provided in this document is subject to legal disclaimers. Rev. 7 — 20 January 2011 ...

Page 8

... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date BAS32L v.7 20110120 • Modifications: Table 4 “Marking • Section 13 “Legal BAS32L v.6 20081029 BAS32L v.5 20080103 BAS32L v.4 20050322 BAS32L v.3 20020123 BAS32L v.2 19960910 BAS32L v.1 19960423 BAS32L Product data sheet ...

Page 9

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 10

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 11

... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering ...

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