MMBD7000LT1G ON Semiconductor, MMBD7000LT1G Datasheet - Page 2
![DIODE SWITCH DUAL 100V SOT23](/photos/1/38/13877/sot-23-3_to-236-3_micro3_ssd3_sst3_sml.jpg)
MMBD7000LT1G
Manufacturer Part Number
MMBD7000LT1G
Description
DIODE SWITCH DUAL 100V SOT23
Manufacturer
ON Semiconductor
Specifications of MMBD7000LT1G
Voltage - Forward (vf) (max) @ If
1.1V @ 100mA
Current - Reverse Leakage @ Vr
3µA @ 100V
Current - Average Rectified (io) (per Diode)
200mA (DC)
Voltage - Dc Reverse (vr) (max)
100V
Reverse Recovery Time (trr)
4ns
Diode Type
Standard
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Product
Switching Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
0.2 A
Max Surge Current
0.5 A
Configuration
Dual Series
Recovery Time
4 ns
Forward Voltage Drop
1.1 V
Maximum Reverse Leakage Current
3 uA
Operating Temperature Range
- 55 C to + 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Mounting Style
SMD/SMT
Capacitance, Junction
1.5 pF
Current, Forward
200 mA
Current, Surge
500 mA
Package Type
SOT-23 (TO-236AB)
Power Dissipation
225 mW
Primary Type
Rectifier
Speed, Switching
Switching
Temperature, Junction, Maximum
+150 °C
Temperature, Operating
-55 to +150 °C
Time, Recovery
4 ns
Voltage, Forward
1.1 V
Voltage, Reverse
100 V
Rectifier Type
Small Signal Switching Diode
Peak Rep Rev Volt
100V
Avg. Forward Curr (max)
0.2A
Rev Curr
3uA
Peak Non-repetitive Surge Current (max)
0.5A
Forward Voltage
1.1V
Operating Temp Range
-55C to 150C
Rev Recov Time
4ns
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MMBD7000LT1GOS
MMBD7000LT1GOS
MMBD7000LT1GOSTR
MMBD7000LT1GOS
MMBD7000LT1GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMBD7000LT1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
MMBD7000LT1G
Manufacturer:
ON/安森美
Quantity:
20 000
Product Bulletin #16134
3.
Parts with a smooth bottom surface finish have been attributed with higher failure rates as compared to failure rates
of parts with a matte finish. A matte finish has more surface area for the glue to adhere to as compared to a part
with a smooth surface. As a containment action, ON Semiconductor has placed shipment holds on any inventories
of smooth parts and has notified some customers who have received smooth parts.
We also suspended manufacturing on mold systems that produce smooth parts to have those mold systems
enhanced to produce parts with a matte surface finish. These containment actions have temporarily affected our
capacity but have been resolved and we have returned to full capacity.
The enhanced matte surface is designed to overcome any variability of the mold compound and aids in a
containment action until we can eliminate that variability.
What to do next?
If you have consumed product starting from date code 0814 and have not experienced any component placement
issues on your boards, you should not be affected. Product reliability is not a concern as parts either solder
normally or they don’t.
If you have a manufacturing process that consists of gluing these components to the bottom side of a board in a
wave solder process and have experienced components falling off boards with a greater than normal frequency,
please contact your ON Semiconductor Customer Service Representative or Salesperson to facilitate product
replacement or contact a technical representative to further discuss the issue for containment or other actions.
For technical assistance, please contact:
Asia Pacific/Japan:
Stephen Ng
ON Semiconductor Quality
Phone: +852 26890209
Email:
United States:
Mark Wasilewski
ON Semiconductor Quality
Phone: 602-244-5114
Email:
Europe:
Herve Marchionini
ON Semiconductor Quality,
Phone: +49 89 930 808 36
Email:
Issue Date: 11 Jul 2008
Surface finish of parts
stephen.ng@onsemi.com
m.wasilewski@onsemi.com
herve.marchionini@onsemi.com
Rev.07-02-06
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