1PS75SB45,115 NXP Semiconductors, 1PS75SB45,115 Datasheet - Page 12
![DIODE SCHOTTKY 40V 120MA SC75](/photos/5/31/53190/568-emt3_sot-416_sc-75_sot416_sml.jpg)
1PS75SB45,115
Manufacturer Part Number
1PS75SB45,115
Description
DIODE SCHOTTKY 40V 120MA SC75
Manufacturer
NXP Semiconductors
Datasheet
1.BAS40-04215.pdf
(21 pages)
Specifications of 1PS75SB45,115
Package / Case
EMT3 (SOT-416, SC-75-3)
Voltage - Forward (vf) (max) @ If
1V @ 40mA
Current - Reverse Leakage @ Vr
10µA @ 40V
Current - Average Rectified (io) (per Diode)
120mA (DC)
Voltage - Dc Reverse (vr) (max)
40V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Common Cathode
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
40 V
Forward Continuous Current
120 mA
Max Surge Current
0.2 A
Configuration
Dual Common Cathode
Forward Voltage Drop
380 mV
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
1PS75SB45 T/R
1PS75SB45 T/R
934047510115
1PS75SB45 T/R
934047510115
NXP Semiconductors
10. Soldering
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 15. Reflow soldering footprint SOD323 (SC-76)
Fig 16. Wave soldering footprint SOD323 (SC-76)
Fig 17. Reflow soldering footprint SOD523 (SC-79)
Dimensions in mm
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
2.75
0.95
1.20
BAS40 series; 1PSxxSB4x series
Rev. 08 — 13 January 2010
0.50
(2×)
preferred transport direction during soldering
solder lands
solder resist
occupied area
solder paste
3.05
2.80
2.10
1.60
1.20
5.00
4.40
1.40
0.50
msa433
1.80
1.90
0.60
2.15
msa415
General-purpose Schottky diodes
0.30
0.40
0.50
mgs343
solder lands
solder resist
occupied area
0.60
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2010. All rights reserved.
12 of 21