BTA212X-600B NXP Semiconductors, BTA212X-600B Datasheet
BTA212X-600B
Specifications of BTA212X-600B
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BTA212X-600B Summary of contents
Page 1
... ˚C prior to j surge 16 0 / over any period - Product specification BTA212X series B MAX. MAX. MAX. UNIT 500B 600B 800B 500 600 800 SYMBOL T2 G MAX. UNIT -500 -600 -800 1 1 500 600 800 12 95 105 45 100 ...
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... DRM(max) j CONDITIONS 125 ˚C; DM DRM(max) j exponential waveform; gate open circuit V = 400 125 ˚ T(RMS) without snubber; gate open circuit 0 DRM(max / Product specification BTA212X series B MIN. TYP. MAX. UNIT - 2500 MIN. TYP. MAX. UNIT - - 4.0 K 5.5 K K/W MIN. TYP. MAX. UNIT 2 ...
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... I p 20ms. VGT(25 C) 1.6 I TSM 1.4 time T 1.2 1 0.8 0.6 0.4 100 1000 - Product specification BTA212X series B BT138X 100 Ths / C versus heatsink temperature T hs BT138 0.1 1 surge duration / s , versus surge duration, for sinusoidal T(RMS) currents Hz; T 56˚C. hs VGT(Tj) BT136 0 50 ...
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... Fig.11. Transient thermal impedance dIcom/dt (A/ms) 1000 100 100 150 ( (25˚C), Fig.12. Typical critical rate of change of commutating current Product specification BTA212X series B BT138 typ max 0.5 1 1 BT138 unidirectional bidirectional 0.1ms 1ms 10ms 0.1s 1s 10s versus th j-hs pulse width t ...
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... Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 10.3 max 3.2 3.0 2.8 seating 15.8 19 max. max. plane 3 2 2.54 0.5 5.08 5 Product specification BTA212X series B 4.6 max 2.9 max 6.4 15.8 max 0.6 2.5 1.3 Rev 1.200 1.0 (2x) 0.9 0.7 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 BTA212X series B 6 Product specification Rev 1.200 ...