DAC1003D160HW/C1:1 NXP Semiconductors, DAC1003D160HW/C1:1 Datasheet - Page 3

DAC1003D160HW/HTQFP80/TRAYBDP/

DAC1003D160HW/C1:1

Manufacturer Part Number
DAC1003D160HW/C1:1
Description
DAC1003D160HW/HTQFP80/TRAYBDP/
Manufacturer
NXP Semiconductors
Datasheet

Specifications of DAC1003D160HW/C1:1

Settling Time
16ns
Number Of Bits
10
Data Interface
Parallel
Number Of Converters
2
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
540mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4440
935286682551
DAC1003D160HW/C1
DAC1003D160HW/C1-S
DAC1003D160HW/C1-S
DAC1003D160HW/C1:1
NXP Semiconductors
6. Pinning information
DAC1003D160_2
Product data sheet
6.1 Pinning
6.2 Pin description
Table 2.
Symbol
V
i.c.
V
AGND
CLK
CLKN
AGND
i.c.
DGND
Fig 2. Pin configuration
CCA
CCA
AGND
AGND
DGND
DGND
CLKN
V
V
V
DEC
CLK
CCA
CCA
CCD
i.c.
i.c.
I9
I8
I7
I6
I5
I4
I3
I2
Pin description
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
Pin
1
2
3
4
5
6
7
8
9
Rev. 02 — 13 August 2008
Type
S
I/O
S
G
I
I
G
O
G
[1]
DGND
Description
analog supply voltage
internally connected; leave open
analog supply voltage
analog ground
clock input
complementary clock input
analog ground
internally connected; leave open
digital ground
Dual 10 bits DAC, up to 160 MHz, 2 x interpolation
DAC1003D160
DAC1003D160
© NXP B.V. 2008. All rights reserved.
014aaa533
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
IVIRES
QVIRES
GAPOUT
GAPD
DGND
DGND
DGND
DGND
DGND
V
DGND
DGND
n.c.
n.c.
n.c.
n.c.
DGND
DEC
Q0
Q1
CCD
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