ADN2525ACPZ-REEL7 Analog Devices Inc, ADN2525ACPZ-REEL7 Datasheet - Page 4

IC,Laser Diode/LED Driver,LLCC,16PIN,PLASTIC

ADN2525ACPZ-REEL7

Manufacturer Part Number
ADN2525ACPZ-REEL7
Description
IC,Laser Diode/LED Driver,LLCC,16PIN,PLASTIC
Manufacturer
Analog Devices Inc
Type
Laser Diode Driver (Fiber Optic)r
Datasheet

Specifications of ADN2525ACPZ-REEL7

Data Rate
10.7Gbps
Number Of Channels
1
Voltage - Supply
3.07 V ~ 3.53 V
Current - Supply
39mA
Current - Modulation
80mA
Current - Bias
100mA
Operating Temperature
-40°C ~ 85°C
Package / Case
16-VFQFN, CSP Exposed Pad
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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ADN2525
1
2
3
4
5
6
THERMAL SPECIFICATIONS
Table 2.
Parameter
θ
θ
IC Junction Temperature
Refers to the voltage between the pin for which the compliance voltage is specified and GND.
The pattern used is composed by a repetitive sequence of eight 1s followed by eight 0s at 10.7 Gbps.
Measured using the high speed characterization circuit shown in Figure 3.
The pattern used is K28.5 (00111110101100000101) at a 10.7 Gbps rate.
Only includes current in the ADN2525 VCC pins.
Includes current in ADN2525 VCC pins and dc current in IMODP and IMODN pull-up inductors. See the Power Consumption section for total supply current calculation.
J-PAD
J-TOP
GND
J2
J3
GND
Z
Z
0
0
= 50Ω
= 50Ω
GND
GND
10nF
10nF
GND
GND
GND
Z
Z
0
0
= 50Ω
= 50Ω
Min
2.6
65
VMSET
VBSET
GND
MSET
BSET IBMON IBIAS
VEE
VEE
DATAP
DATAN
VCC
VCC
TP1
AND IMOD
Typ
5.8
72.2
ADN2525
VEE
NC1
IBIAS
1kΩ
ALS
TP2
90%
10%
J8
GND
ALS
GND
10Ω
IMODP
IMODN
J5
Figure 3. High Speed Characterization Circuit
Max
10.7
79.4
125
VCC
VCC
GND
GND
GND
VEE
VEE
10nF
10nF
22µF
Figure 2. ALS Timing Diagram
Z
Z
0
0
ASSERT TIME
= 25Ω
= 25Ω
GND
Rev. A | Page 4 of 16
Unit
°C/W
°C/W
°C
GND
GND
ALS
GND
GND
GND
GND
VEE
70Ω
35Ω
35Ω
GND
BIAS TEE: PICOSECOND PULSE LABS MODEL 5542-219
ADAPTER: PASTERNACK PE-9436 2.92mm FEMALE-TO-FEMALE ADAPTER
ATTENUATOR: PASTERNACK PE-7046 2.92mm 20dB ATTENUATOR
Z
Z
NEGATE TIME
0
0
= 50Ω
= 50Ω
Conditions/Comments
Thermal resistance from junction to bottom of exposed pad
Thermal resistance from junction to top of package
ALS
GND
BIAS
TEE
BIAS
TEE
GND
GND
ADAPTER
ADAPTER
t
t
ATTENUATOR
ATTENUATOR
OSCILLOSCOPE
50Ω
50Ω
GND
GND

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