NCP4586DSQ28T1G ON Semiconductor, NCP4586DSQ28T1G Datasheet - Page 14
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NCP4586DSQ28T1G
Manufacturer Part Number
NCP4586DSQ28T1G
Description
IC REG LDO 150MA 2.8V UDFN5
Manufacturer
ON Semiconductor
Datasheet
1.NCP4586DMU12TCG.pdf
(18 pages)
Specifications of NCP4586DSQ28T1G
Number Of Outputs
1
Input Voltage Max
7 V
Output Voltage
2.8 V
Output Type
Adjustable
Dropout Voltage (max)
0.51 V
Output Current
150 mA
Load Regulation
10 mV
Voltage Regulation Accuracy
1 %
Maximum Power Dissipation
380 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
SC-82AB
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
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Part Number
Manufacturer
Quantity
Price
in Figure 42.
Input Decoupling Capacitor (C1)
connected as close as possible to the input and ground pin of
the NCP4586. Higher values and lower ESR improves line
transient response.
Output Decoupling Capacitor (C2)
sufficient to achieve stable operation of the IC. If a tantalum
capacitor is used, and its ESR is high, loop oscillation may
result. The capacitors should be connected as close as
possible to the output and ground pins. Larger values and
lower ESR improves dynamic parameters.
Enable Operation
regulator on and off. Control polarity is dependent on
VIN
A typical application circuit for NCP4586 series is shown
A 470 nF ceramic input decoupling capacitor should be
A 470 nF or larger ceramic output decoupling capacitor is
The Enable pin CE or CE may be used for turning the
470n
C1
Figure 42. Typical Application Schematic
VIN
CE
NCP4586x
GND
VOUT
APPLICATION INFORMATION
470n
C2
VOUT
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14
version of IC. Active high or low versions are available;
please see the ordering information table. The Enable pin
has an internal pull down current source for versions H and
D. If the enable function is not needed connect the CE pin to
ground for version L or connect the CE pin to VIN for
versions H and D.
Output Discharger
GND that is used for faster discharging of the output
capacitor. This function is activated when the IC goes into
disable mode.
Thermal
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature rise for the part.
That is to say, when the device has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
PCB Layout
high, noise pickup or unstable operation may result. Connect
capacitors C1 and C2 as close as possible to the IC, and make
wiring as short as possible.
The D version includes a transistor between VOUT and
As power across the IC increases, it might become
Make VIN and GND line sufficient. If their impedance is