8444-11B1-RK-TP 3M Interconnect Solutions, 8444-11B1-RK-TP Datasheet
8444-11B1-RK-TP
Specifications of 8444-11B1-RK-TP
Related parts for 8444-11B1-RK-TP
8444-11B1-RK-TP Summary of contents
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Chip Carrier Sockets ™ Low Profile, Four-Row, Through-Hole Physical Insulation Material: Glass Filled Polyester (PBT) Flammability: UL 94V-0 Color: Black Contact Material: Copper Alloy Plating Underplating: 50 μ″, [ 1.27 μm ] Nickel - Overall Wiping Area: 160 μ″, ...
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... Chip Carrier Sockets ™ Low Profile, Four-Row, Through-Hole Contact Part No. Quantity 20 8420-11B1-RK-TP 28 8428-11B1-RK-TP 32 8432-11B1-RK-TP 44 8444-11B1-RK-TP 52 8452-11B1-RK-TP 68 8468-11B1-RK-TP 84 8484-11B1-RK-TP 20 POSITION POSITION Ordering Information 84XX - 11B1 - Note: Parts packaged in tubes. 3 Interconnect Solutions http://www.3M.com/interconnects 15.50 [0.611] 15.50 [0.611] 18.05 [0.711] 18.05 [0.711] 18.05 [0.711] 20 ...
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Important Notice All statements, technical information, and recommendations related to 3M’s products are based on information believed to be reliable, but the accuracy or completeness is not guaranteed. Before using this product, you must evaluate it and determine if it ...