531353-8 TE Connectivity, 531353-8 Datasheet - Page 21
![no-image](/images/manufacturer_photos/0/6/654/te_connectivity_sml.jpg)
531353-8
Manufacturer Part Number
531353-8
Description
Manufacturer
TE Connectivity
Type
Card Edger
Datasheet
1.531353-8.pdf
(53 pages)
Specifications of 531353-8
Number Of Contacts
10POS
Body Orientation
Straight
Termination Method
Solder
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Not Compliant
172
Recommended
PC Board Layouts
Technical Documents:
(pages 186, 187):
Instruction Sheet 408-7037
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Card Edge Connectors
(Board-to-Board, Wire-to-Board)
AMP-LEAF Connector PC Board Layouts
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
DP = Diallyl Phthalate
P = Phenolic
Note: Board thickness .055-.070 [1.4-1.78] all posi-
Positions
Note: Slot for intercontact keying may be
[8.38]
No. of
.330
Min.
tions except 32 position–.084-.104 [2.13-2.64].
10
15
18
22
25
32
8
[0.79]
.031
Base Line
located between any two pads
(except the first two and last two
pads).
Max.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Housing
Material
[1.27]
.050
DP
DP
DP
P
P
P
P
P
P
Min.
A
102.69
129.97
1.396
35.46
1.709
43.40
2.491
63.27
2.487
63.17
2.940
74.68
3.583
91.00
3.578
90.88
4.043
5.117
A
Dimensions
[3.96]
.156
B
.152
3.86
.151
3.84
.153
3.89
.152
3.86
.144
3.66
.153
3.89
.151
3.84
.150
3.81
.140
3.56
B
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967