BLM18AG102SN1 Murata, BLM18AG102SN1 Datasheet - Page 183

• Manufacturer Part Number: BLM18AG102SN1
• Manufacturer: Murata

Specifications of BLM18AG102SN1

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -55C to 125C
• Current Rating (max): 0.4A
• Product Height (mm): 0.8mm
• Product Depth (mm): 0.8mm
• Product Length (mm): 1.6mm
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
2. Solder Paste Printing and Adhesive Application
BLM
BLA
BNX022
BNX023
(Except BLM
15A_AN series)
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
oEnsure that solder is applied smoothly to a
oCoat with solder paste to the following thickness:
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
12.5
10.2
9.9
9.6
7.1
6.2
5.3
2.8
2.3
minimum height of 0.2mm to 0.3mm at the end
surface of the part.
50-80 m: BLM02
100-150 m: BLM03
100-200 m: BLM15/18/21/31/41
pattern printing. Use of Sn-Zn based solder will
deteriorate performance of products. In case of
using Sn-Zn based solder, please contact Murata
in advance.
100-150 m: BLA2A
150-200 m: BLA31
0
0.8
0.4
BLA31
Solder Paste Printing
PSG
B
CG
CG
0.25
CB
CG
1.75
BLA2A
0.25
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
EMIFILr (Soldering and Mounting)
(1) A double-sided print board (or multilayer board) as shown in
(2) Please drop CG on a ground electrode on the back layer
(3) It is recommended to use a double-sided printed circuit
(4) The ground pattern should be designed to be as large as
the left figure is designed, and please apply a soldering Cu
electrode with a product electrode to a "Land Pattern", apply
resist to a "Land Pattern + Solder Resist" at Cu electrode.
(the same also in a multilayer case) by the through hole. And
a surface grand electrode layer may also take a large area
as much as possible.
board with BNX mounting on one side and the ground
pattern on the other in order to maximize filtering
performance, multiple feed through holes are required to
maximize the BNX's connection to ground.
possible to achieve maximum filtering performance.
Coating amount is illustrated in the
following diagram.
PCB
BLA31 Series only
Coating amount is illustrated in the
following diagram.
PCB
Adhesive Application
Chip Solid Inductor
Chip Solid Inductor
Land
Land
Bonding agent
Bonding agent
Continued on the following page.
Land Pattern
+ Solder Resist
Land Pattern
Through Hole
a: 20 70 m
b: 30 35 m
c: 50 105 m
a: 20 70 m
b: 30 35 m
c: 50 105 m
a
a
b
b
(in mm)
(in mm)
c
c
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C31E.pdf
08.9.1
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