GP2W3270XP0F Sharp Microelectronics, GP2W3270XP0F Datasheet - Page 10

• Manufacturer Part Number: GP2W3270XP0F
• Description: Fiber Optic Transmitters, Receivers, Transceivers 115kb bidirectional 890nm 20cm 3V
• Manufacturer: Sharp Microelectronics

Specifications of GP2W3270XP0F

• Product: Transceiver
• Data Rate: 115.2 Kbps
• Wavelength: 890 nm
• Maximum Rise Time: 600 ns, 60 ns
• Maximum Fall Time: 600 ns, 60 ns
• Pulse Width Distortion: 80 us, 2.25 us
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Package / Case: Ultra Small Profile
• Idle Current, Typ @ 25° C: 70µA
• Link Range, Low Power: 20cm
• Operating Temperature: -40°C ~ 85°C
• Orientation: Top View
• Shutdown: *
• Size: 8.3mm x 2.1mm x 1.7mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

■Soldering Method
1. In case of solder reflow
2. Other precautions
3. Soldering
Please carry out only two times soldering at the temperature and the time within the temperature profile as shown
in the figure below. Reflow interval shall be within 3 days under conditions, 10 to 30℃, 70%RH or less.
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin.
So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder.
Even if within the temperature profile above, there is the possibility that the gold wire in package is broken
in case that the deformation of PCB gives the affection to lead pins. Please use after confirming the conditions fully
by actual solder reflow machine.
・Soldering iron shall be less than 25W, and temperature of point of soldering iron shall use at 350℃ or less.
・Soldering time shall be within 5s.
・Soldered product shall treat at normal temperature.
MAX
260℃
220℃
MAX
170℃
25℃
1 to 5℃/s
MAX.120s
10
1 to 5℃/s
MAX.70s
MAX.60s
MAX. 10s
MAX.90s
1 to 5℃/s
GP2W3270XP0F
Sheet No.: E3-A01201EN