HFCT-5953TL Avago Technologies US Inc., HFCT-5953TL Datasheet - Page 4

• Manufacturer Part Number: HFCT-5953TL
• Description: Fiber Optic Transmitters, Receivers, Transceivers OC12 IR 2x5 SFF LC
• Manufacturer: Avago Technologies US Inc.

Specifications of HFCT-5953TL

• Function: High performance, modules for serial optical data communication applications, designed for single mode fiber.
• Product: Transceiver
• Data Rate: 622 Mbps
• Wavelength: 1300 nm
• Maximum Rise Time: 1 ns, 0.5 ns
• Maximum Fall Time: 1 ns, 0.5 ns
• Maximum Output Current: 50 mA
• Operating Supply Voltage: 3.14 V to 3.47 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Package / Case: DIP-10 with Connector
• Optical Fiber Type: TX/RX
• Data Transfer Rate: 622Mbps
• Optical Rise Time: 1/0.5ns
• Optical Fall Time: 1/0.5ns
• Operating Temperature Classification: Commercial
• Peak Wavelength: 1356/1570nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 3.14V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.47V
• Output Current: 50mA
• Operating Temp Range: 0C to 70C
• Mounting: Snap Fit To Panel
• Pin Count: 10
• For Use With: Singlemode Glass
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 3 - Block Diagram.
4
Package
The overall package concept for the Avago Technolo-
gies transceiver consists of four basic elements; two
optical subassemblies and two electrical subassemblies.
They are housed as illustrated in the block diagram in
Figure 3.
The package outline drawing and pin out are shown in
Figures 4, 5 and 6. The details of this package outline
and pin out are compliant with the multisource defini-
tion of the 2 x 5 and 2 x 10 DIP.
The electrical subassemblies consist of high volume
multilayer printed circuit boards on which the IC and
various surface-mounted passive circuit elements are
attached.
The receiver electrical subassembly includes an internal
shield for the electrical and optical subassemblies to en-
sure high immunity to external EMI fields.
PHOTO DETECTOR
BIAS
DATA OUT
DATA OUT
SIGNAL
DATA IN
DATA IN
Tx DISABLE
B
B
P
P
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
Note 2: CONNECTED TO R
Note 3: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
MON
MON
MON
MON
DETECT
(+) Note 1
(-) Note 1
(+) Note 1
(-) Note 1
Note 2
X
V
CC
IN 2 x 5 DESIGN
AND CONTROL
LASER DRIVER
T
X
CIRCUIT
GROUND
QUANTIZER IC
R
T
X
X
SUPPLY
SUPPLY
R
OUTPUT POWER
X
MONITORING
MONITORING
LASER DIODE
LASER BIAS
GROUND
The optical subassemblies are each attached to their
respective transmit or receive electrical subassemblies.
These two units are than fitted within the outer housing
of the transceiver that is molded of filled nonconduc-
tive plastic to provide mechanical strength. The housing
is then encased with a metal EMI protective shield. Four
ground connections are provided for connecting the
EMI shield to signal ground.
The PCB’s for the two electrical subassemblies both car-
ry the signal pins that exit from the bottom of the trans-
ceiver. The solder posts are fastened into the molding of
the device and are designed to provide the mechanical
strength required to withstand the loads imposed on
the transceiver by mating with the LC connectored fiber
cables. Although they are not connected electrically to
the transceiver, it is recommended to connect them to
chassis ground.
Note 1
Note 1
CASE
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
Note 3
LC
RECEPTACLE