MRF89XAM8A-I/RM Microchip Technology, MRF89XAM8A-I/RM Datasheet - Page 14

• Manufacturer Part Number: MRF89XAM8A-I/RM
• Description: TXRX MODULE 868MHZ ULP SUB GHZ
• Manufacturer: Microchip Technology

Specifications of MRF89XAM8A-I/RM

• Wireless Frequency: 868 MHz
• Interface Type: SPI
• Output Power: 12.5 dBm
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Maximum Supply Current: 30 mA
• Minimum Operating Temperature: - 40 C
• Modulation: FSK, OOK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MRF89XAM8A
2.2
The MRF89XAM8A module PCB is constructed with
high temperature FR4 material, 4 layers and 0.032
inches thick. These layers are shown in
through
in
FIGURE 2-3:
FIGURE 2-4:
DS70651A-page 12
Figure 2-9
Figure
Printed Circuit Board
2-8. The stack up of the PCB is shown
TOP SILK SCREEN
TOP COPPER
Figure 2-3
Preliminary
FIGURE 2-5:
FIGURE 2-6:
LAYER 2 — GROUND
PLANE
LAYER 3 — POWER
PLANE
© 2010 Microchip Technology Inc.