175-6-510P Wakefield Thermal Solutions, 175-6-510P Datasheet

Semiconductor Hardware, Insulators

175-6-510P

Manufacturer Part Number
175-6-510P
Description
Semiconductor Hardware, Insulators
Manufacturer
Wakefield Thermal Solutions
Datasheet

Specifications of 175-6-510P

Leaded Process Compatible
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
120 SERIES
126 SERIES
Normally stocked
The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces
with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
resistance of only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable
increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period
(Time versus Thermal Resistivity graph below).
Case Style Characteristics
T0-3
TO-66
0.19 (4.8) stud x 0.44 (11.2) hex
0.38 (9.7) stud x 1.06 (26.9) hex
0.50 (12.7) stud x 1.06 (26.9) hex
TO-220
0.25 (6.4) stud x 0.69 (17.5) hex
0.75 (19.1) stud x 1.25 (31.8) hex
The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide
fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding
that of silicone-based compounds. Solved are problems associated with contamination of wave solder baths and
migration of silicone-based products.
Shelf life: 5 years.
Appearance
Solids Content, wt %
Thermal Conductivity at 36°C = 4.8 (Btu)(in.)/(hr) (ft
Interface Thermal Resistance
Bleed, 24 hrs at 200°C, wt%
Evaporation, 24 hrs at 200°C, wt%
Volume Resistivity
Dielectric Strength
Specific Gravity @ 60°F
Penetration
Operating Range
TYPICAL VALUES FOR THERMAL RESISTANCE,
CASE TO SINK (Ø cs ) WHEN THERMAL JOINT
COMPOUNDS ARE USED
Characteristics
126 SERIES THERMAL JOINT COMPOUND
125 (14.12)
600 (67.79)
Mounting Torque
in inch • pounds Resistance
30 (3.39)
75 (8.47)
15 (1.7)
9 (0.9)
8 (0.9)
8 (0.9)
(N•M)
69
2
) (°F)
Thermal
Typical
(°C/W)
0.09
0.14
0.50
0.16
0.10
0.07
0.07
0.052
Smooth, white homogeneous paste
65% min
19.0 X 10e 4 cal/sec cm °C, min
0.043°C/W TO-3 at 0.0008 thick film
0.09% max
0.6 max
2.3 x 10e 12 ohms/cm
200 volts/mil
2.93 (gm/cc)
280 to 320
-40°C to 200°C
All other products, please contact factory for price, delivery, and minimums.
Volume Resistivity
Dielectric Strength
Specific Gravity
Thermal Conductivity @ WC
Thermal Resistivity (P)
Bleed, % after 24 hrs @ 200°C
Evaporation, % after 24 hrs @ 200°C
Color
Shelf life
Operating Temperature Range (°C)
Description
120 SERIES - THERMAL JOINT COMPOUND
Characteristic
120-5
120-8
120-80
120-320
120-SA
120-2
Series -
120 SERIES - ORDER GUIDE
P/N
126-2
126-4
126-4S
126-5LB
Series -
5 oz (0.14 kg) tube
20 lb (9.08 kg) can
4 gram plastic pak
5 lb (2.27 kg) can
2 oz (0.06 kg) jar
8 oz (0.23 kg) jar
P/N
Container Size
126 SERIES - ORDER GUIDE
5 X 10e 14 ohm/cm
225 volts/mil
2.1 min.
0.735 W/(m)(K)
56 (°C)(in.)/watt
0.5
0.5
opaque white
5 years
-40/+200
5.1(Btu) (in.)/(hr)(ft
Description
4 oz (0.11 kg) syringe
4 oz (0.11 kg) tube
5 lb (2.27 kg) can
2 oz (0.6 kg) jar
Container Size
Accessory
Products
2
)(°F)

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175-6-510P Summary of contents

Page 1

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent ...

Page 2

... The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer's own risk, conditions of use being beyond our control. THERMAL INTERFACE MATERIAL DATA FOR T-SERIES AND S-SERIES T-Series Thermal come ...

Page 3

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaCast™ 153 is a pourable casting resin having thermal expansion characteristics similar to aluminum and DeltaCast™ 153 copper allowing assemblies to operate over a very wide temperature range. Ideal for encapsulating components and assemblies, ...

Page 4

Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaBond™ 155 DeItaBond™ 155 is an epoxy adhesive formulated for use within the semiconductor industry. An easy to mix spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient ...

Page 5

... THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 173/174 SERIES 175 SERIES Characteristics Material Thickness Color Tear Strength, lb/in. Typical The 173, 174, and 175 Volume Resistivity, megohm-cm, Minimum Normal Series are highly Breakdown Voltage, Minimum efficient thermally conductive insulators Dielectric Constant and 100 V Maximum designed for semi - Continuous Use Temperature, ° ...

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