175-6-330P Wakefield Thermal Solutions, 175-6-330P Datasheet

175-6-330P

Manufacturer Part Number

175-6-330P

Description

Semiconductor Hardware, Insulators

Manufacturer

Wakefield Thermal Solutions

Datasheet

1.173-7-240P.pdf (5 pages)

Specifications of 175-6-330P

Length

41.9mm

Mounting Hole Dia

3.4mm

Overall Width

29mm

Thermal Resistance

0.4Â°C/W

Breakdown Voltage Vbr

6000V

Body Material

Kapton

External Depth

0.15mm

Package / Case

TO-3

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS

120 SERIES

126 SERIES

Normally stocked

The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces

with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

resistance of only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable

increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period

(Time versus Thermal Resistivity graph below).

Case Style Characteristics

T0-3

TO-66

0.19 (4.8) stud x 0.44 (11.2) hex

0.38 (9.7) stud x 1.06 (26.9) hex

0.50 (12.7) stud x 1.06 (26.9) hex

TO-220

0.25 (6.4) stud x 0.69 (17.5) hex

0.75 (19.1) stud x 1.25 (31.8) hex

The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide

fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding

that of silicone-based compounds. Solved are problems associated with contamination of wave solder baths and

migration of silicone-based products.

Shelf life: 5 years.

Appearance

Solids Content, wt %

Thermal Conductivity at 36°C = 4.8 (Btu)(in.)/(hr) (ft

Interface Thermal Resistance

Bleed, 24 hrs at 200°C, wt%

Evaporation, 24 hrs at 200°C, wt%

Volume Resistivity

Dielectric Strength

Specific Gravity @ 60°F

Penetration

Operating Range

TYPICAL VALUES FOR THERMAL RESISTANCE,

CASE TO SINK (Ø cs ) WHEN THERMAL JOINT

COMPOUNDS ARE USED

Characteristics

126 SERIES THERMAL JOINT COMPOUND

125 (14.12)

600 (67.79)

Mounting Torque

in inch • pounds Resistance

30 (3.39)

75 (8.47)

15 (1.7)

9 (0.9)

8 (0.9)

(N•M)

) (°F)

Thermal

Typical

(°C/W)

0.09

0.14

0.50

0.16

0.10

0.07

0.052

Smooth, white homogeneous paste

65% min

19.0 X 10e 4 cal/sec cm °C, min

0.043°C/W TO-3 at 0.0008 thick film

0.09% max

0.6 max

2.3 x 10e 12 ohms/cm

200 volts/mil

2.93 (gm/cc)

280 to 320

-40°C to 200°C

All other products, please contact factory for price, delivery, and minimums.

Volume Resistivity

Dielectric Strength

Specific Gravity

Thermal Conductivity @ WC

Thermal Resistivity (P)

Bleed, % after 24 hrs @ 200°C

Evaporation, % after 24 hrs @ 200°C

Color

Shelf life

Operating Temperature Range (°C)

Description

120 SERIES - THERMAL JOINT COMPOUND

Characteristic

120-5

120-8

120-80

120-320

120-SA

120-2

Series -

120 SERIES - ORDER GUIDE

P/N

126-2

126-4

126-4S

126-5LB

Series -

5 oz (0.14 kg) tube

20 lb (9.08 kg) can

4 gram plastic pak

5 lb (2.27 kg) can

2 oz (0.06 kg) jar

8 oz (0.23 kg) jar

P/N

Container Size

126 SERIES - ORDER GUIDE

5 X 10e 14 ohm/cm

225 volts/mil

2.1 min.

0.735 W/(m)(K)

56 (°C)(in.)/watt

0.5

opaque white

5 years

-40/+200

5.1(Btu) (in.)/(hr)(ft

Description

4 oz (0.11 kg) syringe

4 oz (0.11 kg) tube

5 lb (2.27 kg) can

2 oz (0.6 kg) jar

Container Size

Accessory

Products

)(°F)

Related parts for 175-6-330P

175-6-330P Summary of contents

Page 1

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent ...

Page 2

... The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer's own risk, conditions of use being beyond our control. THERMAL INTERFACE MATERIAL DATA FOR T-SERIES AND S-SERIES T-Series Thermal come ...

Page 3

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaCast™ 153 is a pourable casting resin having thermal expansion characteristics similar to aluminum and DeltaCast™ 153 copper allowing assemblies to operate over a very wide temperature range. Ideal for encapsulating components and assemblies, ...

Page 4

Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaBond™ 155 DeItaBond™ 155 is an epoxy adhesive formulated for use within the semiconductor industry. An easy to mix spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient ...

Page 5

... 175-6-260P 1.000 (25.4) – 175-6-280P 0.860 (21.8) – – 0.855 (21.7) 174-9-310P 175-6-310P 1.593 (40.5) 174-9-320P 175-6-320P 1.650 (41.9) 174-9-330P 175-6-330P 1.650 (41.9) – 175-6-340P 1.780 (45.2) – – 1.563 (39.7) 174-9-410P 175-6-410P 0.625 (15.9)OD 174-9-51OP 175-6-51OP 0.800 (20.3)OD 174-9-520P 175-6-520P 1 ...

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