HSMG-C177 Avago Technologies US Inc., HSMG-C177 Datasheet - Page 9

• Manufacturer Part Number: HSMG-C177
• Description: Surface-Mount/Axial LED Lamp,Green,Diffused,LED-8d
• Manufacturer: Avago Technologies US Inc.
• Type: Uni-Colorr

Specifications of HSMG-C177

• Color: Green
• Millicandela Rating: 15mcd
• Current - Test: 20mA
• Wavelength - Dominant: 572nm
• Wavelength - Peak: 570nm
• Voltage - Forward (vf) Typ: 2.2V
• Lens Type: Diffused
• Lens Style/size: Rectangle, 1.25mm x 1.2mm
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 2.00mm L x 1.25mm W
• Height: 0.40mm
• Viewing Angle: 130°
• Mounting Type: Surface Mount
• Resistance Tolerance: 572nm
• Package Type: Chip Led
• Emitting Color: Yellow Green
• Luminous Intensity: 15mcd
• Test Current (it): 20mA
• Forward Current: 20mA
• Dominant Wave Length: 572nm
• Forward Voltage: 2.6V
• Product Length (mm): 2mm
• Product Height (mm): 0.4mm
• Product Depth (mm): 1.25mm
• Mounting: Surface Mount
• Peak Wavelength: 570nm
• Shape Type: Rectangular
• Chip Material: GaP
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 85C
• Reverse Voltage: 5V
• Power Dissipation: 52mW
• Lens Dimensions: 2X1.25X0.24mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Compliant

Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
Figure 8. Relative intensity vs. angle for HSMx-C150, C170, C190, C191 and C265.
Figure 11. Recommended soldering pattern
for HSMx-C150.
9
Figure 9. Recommended reflow soldering profile.
(0.059)
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
100
1.5
90
80
70
60
50
40
30
20
10
0
-90
0
-90
140-160°C
-80
-80
(0.079)
-70
2.0
-70
OVER 2 MIN.
10 SEC. MAX.
4°C/SEC.
230°C MAX.
-60
-60
MAX.
-50
-50
(0.059)
TIME
1.5
-40
-40
-30
-30
-20
-20
1.5 (0.059)
-10
-10
ANGLE
ANGLE
4°C/SEC. MAX.
0
0
3°C/SEC. MAX.
10
10
Figure 12. Recommended soldering
pattern for HSMx-C170 and C177.
20 30
20 30
(0.047)
1.2
(0.035)
40
40
0.9
50
50
(0.047)
1.2
60
60
70
70
Figure 10. Recommended Pb-free reflow soldering profile.
1.2 (0.047)
80
80
90
90
217 C
200 C
150 C
3 C/SEC. MAX.
3 C/SEC. MAX.
60 - 120 SEC.
255 - 260 C
Figure 13. Recommended soldering pattern
for HSMx-C190, C191 and C197.
(0.031)
0.8
TIME
(0.028)
0.7
10 SEC. MAX.
60 SEC. MAX.
6 C/SEC. MAX.
(0.031)
0.8
0.8 (0.031)