TBPS1R332J410H5Q Taiyo Yuden, TBPS1R332J410H5Q Datasheet - Page 8
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TBPS1R332J410H5Q
Manufacturer Part Number
TBPS1R332J410H5Q
Description
THERM NTC 3.3K OHMS 0603
Manufacturer
Taiyo Yuden
Series
TBPSr
Datasheet
1.TBPS0R103J410H5Q.pdf
(8 pages)
Specifications of TBPS1R332J410H5Q
Resistance In Ohms @ 25°c
3.3K
Resistance Tolerance
±5%
B Value Tolerance
±3%
B25/50
4034K
B25/85
4100K
Operating Temperature
-55°C ~ 125°C
Power - Max
63mW
Mounting Type
Surface Mount
Package / Case
0603 (1608 Metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
B0/50
-
B25/75
-
B25/100
-
Lead Length
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TBPS1R332J410H5Q
Manufacturer:
TAIYO/太诱
Quantity:
20 000
MULTILAYER CHIP NTC THERMISTORS
Note on standard condition:"standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
△
12. Solderability
13. Resistance to Soldering
14. Thermal Shock
15. High Temperature Life Test
16. Damp Heat ( steady state)
!
RELIABILITY DATA
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Item
At least 75% of terminal
electrode is covered by new
solder.
R25 change:Within ±3%
B constant change:
R25 change: Within ±3%
B Constant change:
R25 change: Within ±3%
B Constant change:
R25 change: Within ±3%
B Constant change:
1005 (0402)
Within ±1%
Within ±1%
Within ±1%
Within ±1%
Specified Value
At least 80% of terminal
electrode is covered by new
solder.
R25 change:Within ±5%
B constant change:
R25 change: Within ±5%
B Constant change:
R25 change: Within ±5%
B Constant change:
R25 change: Within ±5%
B Constant change:
1608 (0603)
Within ±3%
Within ±2%
Within ±3%
Within ±3%
According to JIS C5102 clause 8.4.
Solder temperature:230±5℃
Duration:4±1 sec.
Reflow soldering:
Solder temperature:240℃
Duration:5 sec.
Preheating temperature:150℃
Preheating time:90 sec.
Number of reflows:3 times
testing substrate:glass-epoxy-resin substrate
Conditions for 1 cycle
Step1:Minimum operating temperature +0/ー3℃ 30±3 min
Step2:Room temperature 2 to 3 min
Step3:Maximum operating temperature +0/ー3℃ 30±3 min
Step4:Room temperature 2 to 3 min
Number of cycles:5
Recovery:2 to 3 hrs of recovery under the standard condition after the test.
Temperature:125±2℃
Duration:1000±12 hrs
Recovery:2 hrs of recovery under the standard condition after the removal
testing substrate:glass-epoxy-resin substrate
Temperature:85±2℃
Humidity:85±5%RH
Duration:1000±12 hrs
Recovery:2 hrs of recovery under the standard condition after the removal
testing substrate:glass-epoxy-resin substrate
from test chamber.
from test chamber.
△
!
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
Test Methods and Remarks
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