NTHS0603N01N6802JE Vishay, NTHS0603N01N6802JE Datasheet - Page 77
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NTHS0603N01N6802JE
Manufacturer Part Number
NTHS0603N01N6802JE
Description
THERMISTOR NTC 68K OHM 5% 0603
Manufacturer
Vishay
Series
NTHSr
Type
NTCr
Datasheets
1.S29GL032N90TFI010.pdf
(81 pages)
2.NTHS0603N02N1002KE.pdf
(3 pages)
3.NTHS0603N01N6802JE.pdf
(3 pages)
Specifications of NTHS0603N01N6802JE
Resistance In Ohms @ 25°c
68K
Resistance Tolerance
±5%
B Value Tolerance
±3%
B25/75
3964K
Mounting Type
Surface Mount
Package / Case
0603 (1608 Metric)
Description Of Terminals
Leadless
Mounting Style
Surface Mount
Pin Count
2
Screening Level
Automotive
Sensitivity Index
3964K
Resistance @ 25c
68kohm
Percentage Of Resistance Tolerance @ 25c
±5
Accuracy
±3
Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
125C
Product Length (mm)
1.6mm
Product Depth (mm)
0.8mm
Lead Free Status / RoHS Status
Lead free by exemption / RoHS Compliant
B0/50
-
B25/50
-
B25/85
-
B25/100
-
Operating Temperature
-
Power - Max
-
Lead Length
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
541-1104-2
NTHS0603N01N6802JE
NTHS0603N01N6802JE
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTHS0603N01N6802JE
Manufacturer:
VISHAY/威世
Quantity:
20 000
17.4
October 29, 2008 S29GL-N_01_12
LAA064—64-Ball Fortified Ball Grid Array (BGA) 13 x 11 mm Package
PACKAGE
JEDEC
SYMBOL
SD / SE
MD
ME
A1
A2
D1
E1
eD
eE
φb
A
D
E
N
MIN
0.40
0.60
0.50
---
13.00 mm x 11.00 mm
13.00 BSC.
11.00 BSC.
PACKAGE
7.00 BSC.
7.00 BSC.
1.00 BSC.
1.00 BSC.
0.50 BSC.
LAA 064
NONE
NOM
0.60
N/A
64
---
---
---
8
8
MAX
1.40
0.70
---
---
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
D a t a
S29GL-N MirrorBit
NOTE
S h e e t
®
Flash Family
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3354 \ 16-038.12d
77