NTCS0603E3222FMT Vishay, NTCS0603E3222FMT Datasheet - Page 6
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NTCS0603E3222FMT
Manufacturer Part Number
NTCS0603E3222FMT
Description
THERMISTOR NTC 2.2K 1% 0603
Manufacturer
Vishay
Type
NTCr
Datasheets
1.NTCS0603E3103JMT.pdf
(7 pages)
2.NTCS0603E3103JMT.pdf
(1 pages)
3.NTCS0603E3222FMT.pdf
(7 pages)
Specifications of NTCS0603E3222FMT
Resistance In Ohms @ 25°c
2.2K
Resistance Tolerance
±1%
B Value Tolerance
±1%
B25/85
3520K
Operating Temperature
-40°C ~ 150°C
Power - Max
125mW
Mounting Type
Surface Mount
Package / Case
0603 (1608 Metric)
Description Of Terminals
Leadless
Mounting Style
Surface Mount
Pin Count
2
Screening Level
Automotive
Sensitivity Index
3520K
Resistance @ 25c
2.2kohm
Thermal Time Constant
8s
Percentage Of Resistance Tolerance @ 25c
±1
Accuracy
±1
Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
150C
Product Length (mm)
1.6mm
Product Height (mm)
0.8mm
Product Depth (mm)
0.8mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
B0/50
-
B25/50
-
B25/75
-
B25/100
-
Lead Length
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
BC2478TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NTCS0603E3222FMT
Manufacturer:
VISHAY
Quantity:
40 000
Part Number:
NTCS0603E3222FMT
Manufacturer:
VISHAY/威世
Quantity:
20 000
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
Document Number: 29056
Revision: 10-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D
0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A
0
B
P
50
0
1
P
Reflow Soldering
2
TEST METHOD
2 K/s
P
0
100
T
C
Time (s)
150
For technical questions, contact:
10 s
10 s
E
F
JWB288
This datasheet is subject to change without notice.
40 s
1.0
Resistance to soldering heat
1
SMD 0603, Glass Protected
W
200
Solderability
NTC Thermistors
0.8
Dimensions of the solder lands
TEST
T
T
250
1
2.4
Notes
• Measured 0.3 mm above base pocket
• P
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
1
0
0
1
0
1
2
0
0
cover tape
nlr@vishay.com
(1)
(1)
(2)
pitch cumulative error over any 10 pitches ± 0.2 mm
300
250
200
150
100
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
235 °C
260 °C
50
100
2 K/s
max.
Vishay BCcomponents
≈ 120 °C
DIMENSION
NTCS0603E3.....T
150
Time (s)
< 0.1
1.15
1.75
1.55
Min. 95 % of surface wetted
1.9
8.0
3.5
4.0
4.0
2.0
1.1
200
www.vishay.com/doc?91000
REQUIREMENTS
R/R < 5 %
250
20 s min.
40 s max.
≈ 60 s
TOLERANCE
www.vishay.com
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.1
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
Max.
-
350
15