AS5163-HTST-500 austriamicrosystems, AS5163-HTST-500 Datasheet - Page 31
![IC ENCODER ROTARY 14-TSSOP](/photos/19/50/195020/am_14-tssop_pkg_sml.jpg)
AS5163-HTST-500
Manufacturer Part Number
AS5163-HTST-500
Description
IC ENCODER ROTARY 14-TSSOP
Manufacturer
austriamicrosystems
Type
Linear, Rotary Encoder - Programmabler
Datasheet
1.AS5163-HTST-500.pdf
(36 pages)
Specifications of AS5163-HTST-500
Featured Product
AS5163 - Contactless Magnetic Angle Position Sensor
Sensing Range
30mT ~ 70mT
Voltage - Supply
4.5 V ~ 5.5 V
Current - Supply
20mA
Output Type
Analog, Ratiometric
Operating Temperature
-40°C ~ 150°C
Package / Case
14-TSSOP (0.173", 4.40mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output (max)
-
Features
-
Other names
AS5163-HTST-500TR
AS5163
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.2.3 Physical Placement of the Magnet
The best linearity can be achieved by placing the center of the magnet exactly over the defined center of the chip as shown in
Figure
26.
Figure 26. Defined Chip Center and Magnet Displacement Radius
3.2mm
3.2mm
1
Defined
center
R
d
Area of recommended maximum magnet
misalignment
8.2.4 Magnet Placement
The magnet’s center axis should be aligned within a displacement radius R
of 0.25mm (larger magnets allow more displacement) from the
d
defined center of the IC.
The magnet may be placed below or above the device. The distance should be chosen such that the magnetic field on the die surface is within
the specified limits
(see Figure
26). The typical distance “z” between the magnet and the package surface is 0.5mm to 1.5mm, provided the
recommended magnet material and dimensions (6mm x 3mm) are used. Larger distances are possible, as long as, the required magnetic field
strength stays within the defined limits.
However, a magnetic field outside the specified range may still produce usable results, but the out-of-range condition will be indicated by an
alarm forcing the output into the failure band.
Figure 27. Vertical Placement of the Magnet
N
S
Package surface
Die surface
www.austriamicrosystems.com/AS5163
Revision 2.7
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