PIC16F76-E/SP Microchip Technology, PIC16F76-E/SP Datasheet - Page 4
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PIC16F76-E/SP
Manufacturer Part Number
PIC16F76-E/SP
Description
28 PIN, 14KB STD FLASH, 368 RAM, 22 I/O,
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F76-E/SP
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC16F76E/SP
PIC16F73/74/76/77
4. Module: Packaging (Pinout and Product
FIGURE 1:
DS80165A-page 4
PIC16F74 and PIC16F77 devices are now offered
in a 44-pin, micro lead frame package (commonly
known as “QFN”). This provides near chip scale
package size. This option is in addition to the 28-pin
QFN packages already available for the PIC16F73
and PIC16F76 devices. The 44-pin QFN package
has been added to the product line since the
original publication of the Device Data Sheet.
The addition of this option requires the following
additions to the Device Data Sheet (DS30325B).
Referenced figures and tables follow this text.
1. The “Pin Diagrams” on pages 2-3 of the Data
2. Table 1.3 of Section 1.0 (“Device Overview”) is
Sheet are amended with the addition of the
44-pin QFN pinout shown in Figure 1.
replaced with an updated version which adds a
column for QFN pin assignments. All new
information is indicated in bold.
44-Pin QFN
Identification)
PINOUT DIAGRAM FOR PIC16F74/77, 44-PIN QFN PACKAGE
RC7/RX/DT
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
RB0/INT0
RB1
RB2
V
V
V
DD
DD
SS
1
2
3
4
5
6
7
8
9
10
11
PIC16F74
PIC16F77
3. Section 17.1 (“Package Marking Information”)
4. Section 17.2 (“Package Details”) is amended
5. In the
33
32
31
30
29
28
27
26
25
24
23
is amended to include a marking template and
example for 44-pin QFN devices. These are
shown in Figure 2.
to include the mechanical drawing of the 44-pin
QFN package, following the existing drawings.
This is shown in Figure 3.
System” (page 171), the “ML” line item in the
“Package” options section should now read
(change in bold):
ML =
For the sake of completeness, it is also noted
that the package designation “MLF” is now
replaced by “QFN” in all occurrences through-
out the Device Data Sheet. “MLF” should be
considered an obsoleted term.
OSC2/CLKO
OSC1/CLKI
V
V
V
V
RE2/AN7/CS
RE1/AN6/WR
RE0/AN5/RD
RA5/AN4/SS
RA4/T0CKI
QFN
SS
SS
DD
DD
“PIC16F7X
2003 Microchip Technology Inc.
Product Identification