PIC16F677T-E/SS Microchip Technology, PIC16F677T-E/SS Datasheet - Page 241
PIC16F677T-E/SS
Manufacturer Part Number
PIC16F677T-E/SS
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SSOP,20PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F690DM-PCTLHS.pdf
(306 pages)
3.PIC16F677-IP.pdf
(2 pages)
4.PIC16F677-IP.pdf
(16 pages)
Specifications of PIC16F677T-E/SS
Rohs Compliant
YES
Mfg Application Notes
Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
18
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
20-SSOP
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
18
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS1-1 - SOCKET TRANSITION 20DIP 20SSOPDM164125 - BOARD DEMO PICDEM TOUCH SENSE 1AC162061 - HEADER INTRFC MPLAB ICD2 20PIN
Lead Free Status / Rohs Status
Details
- PIC16F616T-ISL PDF datasheet
- PIC16F690DM-PCTLHS PDF datasheet #2
- PIC16F677-IP PDF datasheet #3
- PIC16F677-IP PDF datasheet #4
- Current page: 241 of 306
- Download datasheet (6Mb)
17.5
© 2008 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power.
DD
A
JA
JC
DIE
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
PIC16F631/677/685/687/689/690
A
≤ +125°C
108.1
Typ.
62.4
85.2
28.1
24.2
32.2
150
2.5
40
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
OL
(T
+ P
x V
DIE
) + Σ (I
DD
I
/
O
- T
DS41262E-page 239
A
OH
)/θ
* (V
JA
DD
- V
OH
))
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