HTMS8001FTB/AF,115 NXP Semiconductors, HTMS8001FTB/AF,115 Datasheet
HTMS8001FTB/AF,115
Specifications of HTMS8001FTB/AF,115
Related parts for HTMS8001FTB/AF,115
HTMS8001FTB/AF,115 Summary of contents
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... The HITAG product line is well known and established in the contactless identification market. Due to the open marketing strategy of NXP Semiconductors there are various manufacturers well established for both the transponders/cards as well as the read/write devices. All of them supporting HITAG 1, HITAG 2 and HITAG S transponder ICs. ...
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... NXP Semiconductors 1.1.3 Beer keg and gas cylinder logistic • Recognizing a complete pallet of gas cylinders at one time • Long writing distance • Voluntarily change between TTF Mode with user defined data length and read/write modes without changing the configuration on the transponder • ...
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... NXP Semiconductors 2. Features 2.1 Features Integrated circuit for contactless identification transponders and cards Integrated resonance capacitor of 210 pF with ± 3% tolerance or 280 pF with ± 5% tolerance over full production Frequency range 100 kHz to 150 kHz 2.2 Protocol Modulation read/write device → transponder: 100 % ASK and binary pulse length coding Modulation transponder → ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Name HTMS1001FUG/AM Wafer HTMS1101FUG/AM Wafer HTMS1201FUG/AM Wafer HTMS8001FUG/AM Wafer HTMS8101FUG/AM Wafer HTMS8201FUG/AM Wafer HTMS1001FTB/AF XSON3 HTMS1101FTB/AF XSON3 HTMS1201FTB/AF XSON3 HTMS8001FTB/AF XSON3 HTMS8101FTB/AF XSON3 HTMS8201FTB/AF XSON3 HTMS1001FTK/AF HVSON2 HTMS1101FTK/AF HVSON2 HTMS1201FTK/AF HVSON2 ...
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... NXP Semiconductors 4. Block diagram The HITAG µ transponder ICs require no external power supply. The contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the read/write device (RWD). The interface also demodulates data transmitted from the RWD to the HITAG µ transponder IC, and modulates the magnetic field for data transmission from the HITAG µ ...
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... NXP Semiconductors 5. Pinning information Fig 2. HITAG µ - Mega bumps bondpad locations Table 2. Description (X) chip size (Y) chip size (1) pad center to chip edge (2) pad center to chip edge (3) pad center to chip edge (4) pad center to chip edge (5) pad center to chip edge (6) pad center to chip edge ...
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... NXP Semiconductors 6. Mechanical specification 6.1 Wafer specification See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die 6.1.1 Wafer • Designation: • Diameter: • Thickness: • Process: • Batch size: • PGDW: 6.1.2 Wafer backside • Material: • Treatment: • ...
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... NXP Semiconductors 6.1.5 Au bump • Bump material: • Bump hardness: • Bump shear strength: • Bump height: • Bump height uniformity: – within a die: – within a wafer: – wafer to wafer: • Bump flatness: • Bump size: – LA, LB – TEST, GND, VDD – ...
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... NXP Semiconductors 7. Functional description 7.1 Memory organization The EEPROM has a capacity 1760 bit and is organized in blocks of 4 bytes each (1 block = 32 bits). A block is the smallest access unit. The HITAG µ transponder IC is available with different memory sizes as shown in “Memory organization HITAG m Advanced (512 bit)” ...
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... NXP Semiconductors 7.1.2 Memory organization HITAG µ Advanced Table 4. Block address FFh FEh 0Fh 0Eh 0Dh 0Ch 0Bh 0Ah 09h 08h 07h 06h 05h 04h 03h 02h 01h 00h [1] RO: Read without password, write with password [2] R/W: Read and write without password ...
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... NXP Semiconductors 7.1.3 Memory organization HITAG µ Advanced + Table 5. Block address FFh FEh 36h 35h ... 14h 13h 12h 11h 10h 0Fh 0Eh 0Dh 0Ch 0Bh 0Ah 09h 08h 07h 06h 05h 04h 03h 02h 01h 00h [1] RO: Read without password, write with password ...
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... NXP Semiconductors 7.2 Memory configuration The user configuration block consists of one configurable byte (Byte0) and three reserved bytes (Byte1 to Byte3) The bits in the user configuration block enable a customized configuration of the HITAG µ transponder ICs. In TTF mode the user can choose Bi-phase or Manchester encoding and also the data rate for the return link (bit0 to bit2) ...
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... NXP Semiconductors 8. General requirements The HITAG μ transponder ICs are compatible with ISO 11785. At the time a HITAG μ transponder the interrogator field it will respond according to ISO 11785. A HITAG μ advanced/advanced+ can be identified as a transponder being in the data exchange mode (advanced mode) by the type information in the reserved bit field sent to the RWD. • ...
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... NXP Semiconductors The steps necessary to transfer the HITAG μ transponder IC into the data exchange mode are shown in example in then are transmitted by the HITAG µ transponder IC. reader field HITAG μ response Fig 3. RF interface for HITAG µ Cycle A: Cycle B: Cycle C: Cycle D: Cycle E: ...
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... NXP Semiconductors 9.2 Mode switching protocol After powering the HITAG µ transponder IC switches to the data exchange mode after receiving one of the two possible switch commands from the RWD during the specified switch window (see Fig 4. Switching window timing Table 7. Parameter Interrogation field modulation ...
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... NXP Semiconductors The RWD sends either the SOF at the start of a valid request or a special switch command to the HITAG µ (as shown in exchange mode. carrier on carrier off transceiver carrier on carrier off Fig 5. Reader downlink modulation for SWITCH command 9.2.1 SWITCH Setting the transponder into data exchange mode (advanced mode) is done by sending SOF pattern or the switch command within the listening window (232 ...
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... NXP Semiconductors 9.3 Downlink communication signal interface - RWD to HITAG µ transponder IC 9.3.1 Modulation parameters Communications between RWD and HITAG µ transponder IC takes place using ASK modulation with a modulation index of m > 90%. Fig 6. Modulation details of data transmission from RWD to HITAG µ transponder IC Table 9 ...
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... NXP Semiconductors 9.3.2 Data rate and data coding The RWD to HITAG µ transponder IC communication uses Pulse Interval Encoding. The RWD creates pulses by switching the carrier off as described in between the falling edges of the pulses determines either the value of the data bit ’0’, the data bit ’ ...
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... NXP Semiconductors 9.3.3 RWD - Start of frame pattern The RWD requests in the data exchange mode always a start with a SOF pattern for ease of synchronization. The SOF pattern consists of an encoded data bit ’0’ and a ’code violation’. carrier on carrier off Fig 8. Start of frame pattern The HITAG µ ...
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... NXP Semiconductors 9.4 Communication signal interface - HITAG µ transponder IC to RWD 9.4.1 Data rate and data coding The HITAG µ transponder IC accepts the following data rates and encoding schemes: • 1/T Differential bi-phase coded data signal in the ISO 11785 mode, without SOF and ...
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... NXP Semiconductors 9.4.2 Start of frame pattern The HITAG µ transponder IC response - if not in ISO 11785 compliant mode - always starts with a SOF pattern. The SOF is a Manchester encoded bit sequence of ’110’. Fig 12. Start of fame pattern 9.4.3 End of frame pattern A specific EOF pattern is neither used nor specified for the HITAG µ transponder IC response ...
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... NXP Semiconductors 10. General protocol timing specification For requests where an EEPROM erase and/or programming operation is required, the transponder IC returns its response when it has completed the write/lock operation. This will be after 20 ms upon detection of the last falling edge of the interrogator request or after the interrogator has switched off the field. ...
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... NXP Semiconductors 10.2 RWD waiting time before sending a subsequent request • When the RWD has received a HITAG µ advanced/advanced+ response to a previous request other than inventory and quiet, it needs to wait T subsequent request. T HITAG µ advanced/advanced+. • When the RWD has sent a quiet request, it needs to wait T subsequent request EOF pulse + 42 × ...
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... NXP Semiconductors 10.3.2 RWD receives no HITAG µ transponder IC response During an inventory process, when the RWD has received no HITAG µ advanced/advanced+ transponder IC response, it needs to wait T subsequent EOF to switch to the next slot slot anticollision request is processed, or sending a subsequent request (which could be again an inventory request). ...
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... NXP Semiconductors 11. State diagram 11.1 General description of states RF Off The powering magnetic field is switched off or the HITAG µ transponder IC is out of the field. WAIT After start up phase, the HITAG µ transponder IC is ready to receive the first command. READY The HITAG µ transponder IC enters this state after a valid command, except of the STAY QUIET, SELECT or WRITE-ISO11785 command. If there are several HITAG µ ...
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... NXP Semiconductors 11.2 State diagram HITAG µ advanced/advanced any other request with SEL flag not set „go to RF-off state“ any other request with ADR flag set Fig 15. State diagram of HITAG µ advanced/advanced+ transponder ICs 152931 Product data sheet PUBLIC out of field ...
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... NXP Semiconductors 11.3 State diagram HITAG µ Fig 16. State diagram of HITAG µ transponder IC 152931 Product data sheet PUBLIC out of field or RF off No request WAIT and RF on for time-out ISO 11785 FDX-B valid request „read UID“ or any other request with SEL flag not set Rev. 3.1 — ...
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... NXP Semiconductors 12. Modes 12.1 ISO 11785 Mode This mode is also named TTF (Transponder Talks First). Every time a transponder IC is activated by the field it starts executing this mode. After waiting the maximum listening window time (see continuously its TTF data (128-bit). The TTF data stored in the memory will be not checked for ISO compliance, therefore data will be sent as stored in the EEPROM ...
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... NXP Semiconductors 12.3.2 Anticollision with 16 slots The transponder IC will receive several inventory commands with NOS = '0' defining an amount of 16 slots. Within the request there is the mask specified by length and value (sent LSB first). In case of mask length = '0' the four least significant bits of transponder ICs UID become the starting value of transponder IC's slot counter. In case of mask length ≠ ...
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... NXP Semiconductors 13. Command set The first part of this section command. The following subsections implemented commands and their suitable transponder IC responses which are done with tables showing the command itself and suitable responses. Within tables flags, parameter bits and parts of a response written in braces are optional. ...
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... NXP Semiconductors 13.1 Flags Every request command contains five flags which are sent in order Bit 1 (LSB) to Bit 5 (MSB). The specific meaning depends on the context. Table 14. Bit Flag 1 PEXT 2 INV 3 CRCT 4 SEL (INV==0) 5 ADR (INV==0) 4 RFU (INV==1) 5 NOS (INV==1) Table 15 ...
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... NXP Semiconductors 13.2 Error handling In case an error has been occurred the transponder IC responses with the set error flag and the three bit code ’111’ (meaning ’unknown error’). The general response format in case of an error response is shown in commands not supporting error responses are excluded. In case of an unsupported command there will be no response ...
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... NXP Semiconductors 13.3 INVENTORY [Advanced, Advanced+] Upon reception of this command without error, all transponder ICs in the ready state shall perform the anticollision sequence. The inventory (INV) flag shall be set to '1'. The NOS flag determines whether slots are used transponder IC detects any error, it shall remain silent. ...
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... NXP Semiconductors 13.4 INVENTORY ISO 11785 [Advanced, Advanced+] Upon reception of this command without error, all transponder ICs in the ready state are performing the anticollision sequence. The inventory (INV) flag is set to '1'. The NOS flag determines whether slots are used. In contrast to INVENTORY command the transponder IC (holding requested slot) sends the 64-bit ISO 11785 number in addition to remaining UID ...
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... NXP Semiconductors 13.6 READ UID [μ, Advanced, Advanced+] Upon reception of this command without error all transponder ICs in the ready state are sending their UID. The addressed (ADR), the select (SEL), the inventory (INV) and the (PEXT) flag are set to '0'. Table 23. ...
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... NXP Semiconductors 13.7 READ MULTIPLE BLOCK [μ, Advanced, Advanced+] Upon reception of this command without error, the transponder reads the requested block(s) and sends back their value in the response. The blocks are numbered from 0 to 255. The number of blocks in the request is one less than the number of blocks that the transponder returns in its response i.e. a value of '6' in the ’ ...
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... NXP Semiconductors 13.7.1 READ MULTIPLE BLOCKS in INVENTORY mode [Advanced, Advanced+] The READ MULTIPLE BLOCK command can also be sent in inventory mode (which is marked by INV-Flag = '1' within the request). Here request and response will change as shown in following tables. If the transponder detects an error during the inventory sequence, it shall remain silent. ...
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... NXP Semiconductors 13.8 WRITE SINGLE BLOCK [μ, Advanced, Advanced+] Upon reception of this command without error, the transponder IC writes 32-bit of data into the requested user memory block and report the success of the operation in the response. Table 30. Flags 5 (1)0(1)00 0(1)(1)00 01(1)00 Table 31. ...
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... NXP Semiconductors 13.9 LOCK BLOCK [μ, Advanced, Advanced+] Upon reception of this command without error, the transponder IC is write locking the requested block (block size = 32-bit) permanently. Blocks within the block address range from 00h to 18h as well as FEh and FFh can be locked individually. ...
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... NXP Semiconductors 13.10 SELECT [Advanced, Advanced+] The SELECT command is always be executed with SEL flag set to '0' and ADR flag set to '1'. There are several possibilities upon reception of this command without error: • If the UID, received by the transponder IC, is equal to its own UID, the transponder IC enters the Selected state and shall send a response. • ...
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... NXP Semiconductors 13.11 WRITE ISO 11785 (custom command) [μ, Advanced, Advanced+] Upon reception of this command without error, the transponder IC (in Ready state) writes 128-bit of ISO 11785 TTF data into suitable reserved memory block and report the success of the operation in the response. The user does not have to attend whether the data is compliant to ISO 11785 or not. The command data block is sent exactly the same way sent by the transponder IC in TTF mode (Header, 64-bit ID, CRC… ...
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... NXP Semiconductors 13.12 GET SYSTEM INFORMATION [Advanced, Advanced+] Upon reception of this command without error, the transponder IC reads the requested system memory block(s) and sends back their values in the response. Table 40. Flags 5 00(1)00 10(1)00 Table 41. Error Data flag MSN MFC ICR 0 Error Flag set to ’0’ indicates no error. ...
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... NXP Semiconductors 13.13 LOGIN [μ, Advanced, Advanced+] Upon reception of this command without error, the transponder IC compares received password with PWD in memory block (FEh) and if correct it permits write (opt. read) access to the protected memory area (defined in User config, see success of the operation in the response. In case a wrong password is issued in a further login request no access to protected memory blocks will be granted ...
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... NXP Semiconductors 14. Transponder Talks First (TTF) mode This mode of the HITAG µ transponder enables data transmission to a RWD without sending any command. Every time the transponder IC is activated by the field it starts executing this mode. The transponder in TTF mode sends the data stored in the EEPROM independent if the data is ISO compliant or not ...
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... NXP Semiconductors 16. Limiting values [1][2] Table 45. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter T storage temperature stg V electrostatic discharge voltage ESD I maximum input current i(max) Tj junction temperature [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied ...
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... NXP Semiconductors 18. Marking 18.1 Marking SOT1122 Table 47. Type HTMS1001FTB/AF HTMS1101FTB/AF HTMS1201FTB/AF HTMS8001FTB/AF HTMS8101FTB/AF HTMS8201FTB/AF Table 48. Pin 152931 Product data sheet PUBLIC Marking SOT1122 Pin description SOT1122 Description n.c not connected Rev. 3.1 — 21 January 2010 152931 HITAG µ Transponder IC Type code ...
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... NXP Semiconductors 18.2 Marking HVSON2 Only two lines are available for marking Fig 20. Marking overview First line consists on five digits and contains the diffusion lot number. Second line consists on four digits and describes the product type, HTSH5601ETK or HTSH4801ETK (see example in Table 49. ...
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... NXP Semiconductors 19. Package outline 4× (2) type code mensions (1) Unit max 0.50 0.04 0.45 0.55 m nom 0.40 0.50 min 0.37 0.47 tes Dimension A is including plating thickness. Can be visible in some manufacturing processes. Outline version IEC Fig 21. Package outline SOT1122 152931 Product data sheet ...
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... NXP Semiconductors HVSON2: plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 × 2 × 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.9 2 0.7 1.9 Note 1. Plastic or metal protrusions of 0.75 mm maximum per side are not included ...
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... NXP Semiconductors 20. Abbreviations Table 51. Abbreviation AC ASK BC BPLC CRC DSFID EEPROM EOF ICR LSB LSByte m MC MFC MSB MSByte MSN NA NOB NOP NOS NSS OTP PID PWD RFU RND RO RTF R/W RWD SOF TTF UID 152931 Product data sheet PUBLIC Abbreviations Definition ...
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... NXP Semiconductors 21. References [1] Application note — AN10214, HITAG Coil Design Guide, Transponder IC BL-ID Doc.No.: 0814** [2] General specification for 8” wafer on UV-tape with electronic fail die marking — Delivery type description, BL-ID Doc.No.: 1093 ... document version number 152931 Product data sheet PUBLIC 1 Rev. 3.1 — ...
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... Section 17 “Package outline”: removed • Section 20 “Legal 152912 20090619 • Modifications: General update • The drawings have been redesigned to comply with the new identity guidelines of NXP Semiconductors. 152911 20090225 • Modifications: General update 152910 20090114 152931 Product data sheet PUBLIC ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 24. Contact information For more information, please visit: For sales office addresses, please send an email to: 152931 Product data sheet PUBLIC http://www.nxp.com salesaddresses@nxp.com Rev. 3.1 — 21 January 2010 152931 HITAG µ Transponder IC © NXP B.V. 2010. All rights reserved ...
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... NXP Semiconductors 25. Tables Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . . .4 Table 2. HITAG µ - Mega bumps dimensions Table 3. Memory organization HITAG m (128-bit Table 4. Memory organization HITAG µ Advanced (512 bit .10 Table 5. Memory organization HITAG µ Advanced+ (1760 bit Table 6. User configuration block to Byte0 . . . . . . . . . . .12 Table 7. HITAG µ transponder IC air interface ...
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... NXP Semiconductors 26. Figures Fig 1. Block diagram of HITAG µ transponder IC Fig 2. HITAG µ - Mega bumps bondpad locations . . . . . .6 Fig 3. RF interface for HITAG µ .14 Fig 4. Switching window timing . . . . . . . . . . . . . . . . . . .15 Fig 5. Reader downlink modulation for SWITCH command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Fig 6. Modulation details of data transmission from RWD to HITAG µ transponder IC .17 Fig 7. Reader to HITAG µ ...
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... NXP Semiconductors 27. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Target markets . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1.1 Animal identification . . . . . . . . . . . . . . . . . . . . . 1 1.1.2 Laundry automation . . . . . . . . . . . . . . . . . . . . . 1 1.1.3 Beer keg and gas cylinder logistic . . . . . . . . . . 2 1.1.4 Brand protection . . . . . . . . . . . . . . . . . . . . . . . 2 1.2 Customer application support and training . . . . 2 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2 Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.3 Memory 2.4 Supported standards . . . . . . . . . . . . . . . . . . . . 3 2 ...
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... NXP Semiconductors [µ , Advanced, Advanced+]. . . . . . . . . . . . . . . .41 13.12 GET SYSTEM INFORMATION [Advanced, Advanced .42 13.13 LOGIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 [µ , Advanced, Advanced+]. . . . . . . . . . . . . . . .43 14 Transponder Talks First (TTF) mode . . . . . . . 44 15 Data integrity/calculation of CRC . . . . . . . . . . 44 15.1 Data transmission: RWD to HITAG µ transponder 15.2 Data transmission: HITAG µ transponder IC to RWD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 16 Limiting values ...