SL3S1002FTB1,115 NXP Semiconductors, SL3S1002FTB1,115 Datasheet
SL3S1002FTB1,115
Specifications of SL3S1002FTB1,115
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SL3S1002FTB1,115 Summary of contents
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... The G2X is a product out of the NXP Semiconductors UCODE product family. The entire UCODE product family offers anti-collision and collision arbitration functionality. This allows a reader to simultaneously operate multiple labels/tags within its antenna field. ...
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... NXP Semiconductors 1.1 Air interface standards The G2X is certified according EPCglobal 1.0.9 and fully supports all parts of the "Specification for RFID Air Interface EPCglobal, EPCTM Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz - 960 MHz, Version 1.1.0". ...
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... NXP Semiconductors 2. Features 2.1 Key features 512-bit user memory (G2XM only) 240-bit of EPC memory 64-bit tag identifier (TID) including 32-bit unique serial number Memory read protection EAS (Electronic Article Surveillance) command Calibrate command 32-bit kill password to permanently disable the tag 32-bit access password to allow a transition into the secured transmission state ...
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... NXP Semiconductors 3. Applications Supply chain management Item level tagging Asset management Container identification Pallet and case tracking Product authentication 4. Ordering information Table 1. Type number SL3ICS1002FUG/V7AF SL3S1002FTT SL3S1002FTB1 SL3S1002AC0 SL3S1002AC2 Table 2. Type number SL3ICS1202FUG/V7AF SL3S1202FTT SL3S1202FTB1 SL3S1202AC0 SL3S1202AC2 [1] FCS2 Polymer Strap, JEDEC outline standard Copper ...
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... NXP Semiconductors 5. Block diagram The SL3ICS1002/1202 IC consists of three major blocks: - Analog RF Interface - Digital Controller - EEPROM The analog part provides stable supply voltage and demodulates data received from the reader for being processed by the digital part. Further, the modulation transistor of the analog part transmits data back to the reader. ...
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... NXP Semiconductors 6. Wafer layout and pinning information 6.1 Wafer layout (1) X-scribe line width: 56.4 μm (2) Y-scribe line width: 56.4 μm (3) Chip step, x-length: 488.0 μm (4) Chip step, y-length: 470,0 μm (5) Bump to bump distance X (TP1 - RFN): 351,0 μm (6) Bump to bump distance Y (RFN - RFP): 333,0 μm (7) Distance bump to metal sealring X: 40,3 μ ...
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... NXP Semiconductors 6.2 FCS2 layout strap and pinning Fig 3. Pinning - SOT1040-1 Table 3. Symbol LA LB 157335 Product short data sheet CONFIDENTIAL Pin description of SOT1040-1 Pin Description Antenna Connection 1 Antenna Connection 2 Rev. 3.5 — 2 November 2009 157335 SL3ICS1002/1202 UCODE G2XM and G2XL © NXP B.V. 2009. All rights reserved. ...
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... NXP Semiconductors 7. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm DIMENSIONS (mm are the original dimensions) UNIT mm Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1. 4× (2) type code Dimensions (1) Unit max 0.50 0.04 0.45 0.55 mm nom 0.40 0.50 min 0.37 0.47 Notes 1. Dimension A is including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors Table 5. Symbol RFP RFN n.c. Table 6. Type SL3S1202FTB1 SL3S1002FTB1 157335 Product short data sheet CONFIDENTIAL Pin description of SOT1122 Pin Description 1 Ungrouded antenna connector 2 Grounded antenna connector 3 not connected SOT1122 Marking Type code (Marking Rev. 3.5 — 2 November 2009 157335 ...
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... NXP Semiconductors Package FCS2, SOT1040AA1, 12 μm Cu metallization Fig 6. 157335 Product short data sheet CONFIDENTIAL SL3ICS1002/1202 Rev. 3.5 — 2 November 2009 157335 UCODE G2XM and G2XL © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors Package FCS2, SOT1040AB2, 20 μm Al metallization Fig 7. 157335 Product short data sheet CONFIDENTIAL SL3ICS1002/1202 Rev. 3.5 — 2 November 2009 157335 UCODE G2XM and G2XL © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors Fig 8. Splicing drawing SOT1040-1 157335 Product short data sheet CONFIDENTIAL SL3ICS1002/1202 Rev. 3.5 — 2 November 2009 157335 UCODE G2XM and G2XL © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors 8. Limiting values Table 7. In accordance with the Absolute Maximum Rating System (IEC 60134) Voltages are referenced to RFN Symbol Die T stg T oper V ESD TSSOP8, SOT1122 T stg P tot T oper V ESD SOT1040AA1, SOT1040AB2 T oper r.h. stg T stg V ESD [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device ...
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... NXP Semiconductors 9. Characteristics 9.1 Wafer characteristics Table 8. Wafer characteristics Symbol Parameter Memory characteristics t EEPROM data retention RET N EEPROM write endurance WE Interface characteristics P total power dissipation tot f operating frequency oper P minimum operating power supply min C input capacitance (parallel quality factor ( chip Z impedance (915 MHz) modulated jammer suppression ≥ ...
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... NXP Semiconductors 10. G2X Memory According EPCglobal the chip memory is organized in following memory sections: Table 10. Name Reserved memory (32 bit ACCESS and 32 bit KILL password) EPC (excluding 16 bit CRC-16 and 16 bit PC) TID (including unique 32 bit serial number) User memory (G2XM only) The logical address of all memory banks begin at zero (00h). ...
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... TID [3] Bank 11 00h – 1FFh User [1] This is the initial memory content when delivered by NXP Semiconductors [2] G2XL: HEX 3005 FB63 AC1F 3841 EC88 0467 G2XM: HEX 3005 FB63 AC1F 3681 EC88 0468 [3] only G2XM 10.1.1 User memory (only G2XM) The User Memory bank contains a sequential block of 512 bits (32 words of 16 bit) ranging from address 00h to 1Fh ...
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... NXP Semiconductors 11. Revision history Table 12. Revision history Document ID Release date 157335 20091102 • Modifications: Type SOT1122 added • Figure 2 “Wafer layout and pinning 157334 20090805 • Modifications: Table 8 “Wafer • Table 7 “TSSOP8 characteristics” characteristics” removed 157333 20090617 • Modifications: New type FCS2 Aluminum, SOT1040AB2 added • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Tables Table 1. Ordering information G2XM . . . . . . . . . . . . . . . .4 Table 2. Ordering information G2XL Table 3. Pin description of SOT1040 Table 4. Pin description of TSSOP8 . . . . . . . . . . . . . . . . .8 Table 5. Pin description of SOT1122 . . . . . . . . . . . . . . .10 Table 6. SOT1122 Marking .10 15. Figures Fig 1. Block diagram of G2X Fig 2. Wafer layout and pinning information . . . . . . . . . .6 Fig 3. Pinning - SOT1040 Fig 4 ...
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... NXP Semiconductors 16. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Air interface standards . . . . . . . . . . . . . . . . . . . 2 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2 Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.3 Custom commands Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Wafer layout and pinning information . . . . . . . 6 6.1 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 FCS2 layout strap and pinning . . . . . . . . . . . . . 7 7 Package outline ...