TDA9899HN/V2,551 NXP Semiconductors, TDA9899HN/V2,551 Datasheet - Page 98
TDA9899HN/V2,551
Manufacturer Part Number
TDA9899HN/V2,551
Description
IC IF PROCESSOR MULTISTD 48HVQFN
Manufacturer
NXP Semiconductors
Datasheet
1.TDA9899HLV2151.pdf
(103 pages)
Specifications of TDA9899HN/V2,551
Function
IF Processor
Rf Type
ATV, DVB, FM
Package / Case
48-VFQFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935282856551
TDA9899HN/V2-S
TDA9899HN/V2-S
TDA9899HN/V2-S
TDA9899HN/V2-S
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TDA9899_3
Product data sheet
16.3.2 Wave soldering
Table 60.
Table 61.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 52. Temperature profiles for large and small components
2.5
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
Figure
52.
Rev. 03 — 15 January 2008
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
Multistandard hybrid IF processing including car mobile
minimum peak temperature
= MSL limit, damage level
3
3
)
)
350 to 2000
260
250
245
220
220
350
temperature
peak
> 2000
260
245
245
TDA9899
© NXP B.V. 2008. All rights reserved.
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