AXT650124 Panasonic Electric Works, AXT650124 Datasheet - Page 6

• Manufacturer Part Number: AXT650124
• Description: CONN HEADER F4S .4MM 50POS SMD
• Manufacturer: Panasonic Electric Works
• Series: F4Sr

Specifications of AXT650124

• Connector Type: Header, Center Strip Contacts
• Number Of Positions: 50
• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Mated Stacking Heights: 1mm
• Height Above Board: 0.033" (0.84mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Other names: 255-2399-2

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With the change in specifications being sought after to
accommodate such factors as smaller devices and varied
environments, the level of reliability required of connectors
has increased. Matsushita Electric Works has developed
the
device reliability in a wide range of environments.
Our unique
■ Product
Bellows contact construction
the ability to withstand twisting and
increased resistance to shock of dropping
High precision curved molding that provides the right amount of
spring characteristics for contacts, is made possible through
precision metal processing, one of our core technologies.
A high-level ability to resist shocks
has been made possible. The need
to withstand the shock of dropping
and twisting during insertion has
increased in mobile devices.
■ Simulation analysis
We analyzed what the ideal spring shape
would be to bring the right spring
characteristic to the contact, and then
precision molded it using precision metal
processing, one of our core technologies.
V notch
(resistance to entry of foreign particles)
By using the edge for the contacting part, contact pressure per
unit area has been increased. Compared to contacts up to now,
the ability to remove flux and foreign particles has increased.
Also, the ability to prevent entry of foreign particles before it
happens has increased.
• 2-point contacting • Surface contact to edge contact • Improved
contact movement effect before and after V notch passage • The
combination of these effects greatly improves contact reliability
(resistance to entry of foreign matter)
Putting our customers first…
Patent and Design
now under application
without notch
Tough against foreign particles and flux!
Cross section of the
socket side contact
Cross section of the
header side contact
Tough against dropping!
improves contact reliability
Japan:
Registration of patent
(Patent No. 3726836)
, a technology that will increase
■ V notched
product
More effective in
eliminating flux and
foreign particles, and
also more effective in
keeping foreign particles
from getting inside
Korea:
Registration of patent
(Patent No. 531938)
improved
Taiwan:
Registration of patent
(Patent No. I225323)
■ Evaluation example of plastic powder
■ F4 Contact
adhered on post contact surface
Construction View
Double contact
High Reliability
China and North America:
Patent now under application.
Same effect as
V notch attained
by double contact.
Four Key Points
Anti-solder-rise efficiency increased
due to
Exposed nickel is placed on mid part of socket contacts. This
contact, while being ultra low in profile, prevents solder rise.
• Influence of solder controlled in contact and contact spring parts.
• Solder remains in the terminals and stable fillet mold is possible.
■ Exposed Ni barrier
Improved resistance to corrosion by
gas, etc., due to
This treatment consists of coating surface with a very thin film
to seal pinholes in the gold plating. We have developed this
porosity treatment technology, which ensures the same contact
reliability for thin gold plating as that of thick gold plating.
• Improvement in resistance to corrosion
• Improvement in insertion/ removal durability
• Improvement in contact reliability for digital signals
■ Plating technology
Cross section of the
socket side contact
Au plating
portion
(Porosity treatment technology)
Porosity treatment film
Cu
Tough against corrosive gases!
Ni Au
Ni barrier
Base material
Tough against solder rise!
Exposed
Ni portion
Ni plating
Pinholes
Surrounding gas
F4S
■ Solder rise after reflow
Solder paste coating conditions:
Metal screen thickness; 120 µm; Open ratio 90% (solder amount 136% of recommended value)
Reflow conditions:
(lead-free solder conditions) temperature profile; 260°C peak temperature, atmosphere;
N2 reflow (nitrogen concentration 1,000 ppm)
Example without Ni barrier
porosity treatment
F4
■ Improvement of the corrosion resistance
<Porosity-treated product>
Test conditions SO
P35S
Status of the post’s contact after the sulfur dioxide test
Rises past
lead and into
horizontal
area.
Strong resistance to various environments
For Board-to-Board and Board-to-FPC Connection
Narrow-pitch Connectors Series
F4S, F4, P35S, P4S, P4, P5KL, P5KF, P5K, and P5KS
Temperature: 40±2°C Time: 145 hours
P4S
2
concentration: 10±3 ppm, Humidity: 90 to 95% RH
Example with Ni barrier
P4
<Conventional product>
10
10
10
-1
1
4
P5KL
0
Gold plate thickness (µm)
Relationship between gold plate
thickness and number of pinholes
This shows the relationship between the
thickness of the gold plating on the nickel
plating (1 µm) and the number of pinholes.
Ni exposure
part
P5KF
1
Corroded mainly
at the pinholes.
Limit of
solder rise.
P5K
2
P5KS
7