AXT650124 Panasonic Electric Works, AXT650124 Datasheet - Page 263

• Manufacturer Part Number: AXT650124
• Description: CONN HEADER F4S .4MM 50POS SMD
• Manufacturer: Panasonic Electric Works
• Series: F4Sr

Specifications of AXT650124

• Connector Type: Header, Center Strip Contacts
• Number Of Positions: 50
• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Mated Stacking Heights: 1mm
• Height Above Board: 0.033" (0.84mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Other names: 255-2399-2

AXS2
FEATURES
1. Long life by four-face contact
Inside contacts are so aligned to permit a
firm four-face contact with an IC lead.
Lower insertion force leads to long life.
2. Array contact facilitates smooth
insertion and removal.
Contact status comparison
All contacts are arrayed facing the
contact surface of the IC lead, allowing
for smooth insertion and removal, with
minimum application of force. This
eliminates inner contacts, preventing the
IC from snagging when being inserted.
3. The tulip-shaped contact provides
greater contact wiping action.
266
µIC socket
Round pin
type IC
socket
µIC socket
Compliance with RoHS Directive
Matsushita Electric Works, Ltd.
Long wiping
distance
(Top view)
IC lead
Round pin type
IC socket
Contact
Short wiping
distance
CONSTRUCTION OF CONTACT
Tulip-style µ contact, in which all contacts are
arrayed facing the contact surface of the IC
lead.
4. Porosity treatment provides
superior corrosion resistance.
Porosity treatment is applied to the
contact surfaces. Contact reliability and
anti-corrosiveness equal that of thin or
thick gold plating.
5. Insert molding construction
prevents flux from entering the socket
body.
6. Solder “blow holes” are eliminated
by unique socket construction.
Flow of gas
HIGH RELIABILITY
µSOCKET SERIES
IC SOCKET WITH
There are no gas
pockets, preventing
blowholes from forming
on soldered areas.
Insert molding construction
preventing flux rises.
Pins do not block through-
holes, making it easy for gas
to escape during soldering.
This keeps the socket from
becoming separated from
the socket.
7. Frame construction facilitates
discovery and prevention of IC lead
insertion errors.
Because the contacts are hidden inside
the frame, a contact will not be made
unless the IC is properly inserted. This
makes it easy to test for insertion errors.
Lead bend during IC insertion
If the IC lead is
bent, it will not
enter the
insertion slot,
and fail to make
a contact.
Thus, testing
will reveal an
insertion error.
µIC SOCKETS
µIC socket
Contact design using ABAQUS
(AXS2)
http://www.mew.co.jp/ac/e/
Even if the IC
lead is bent, it
will contact the
external
sleeve. As the
sleeve is
electrically
conductive, testing
will not reveal the
insertion error.
Round pin type
IC socket