AXT650124 Panasonic Electric Works, AXT650124 Datasheet - Page 193

• Manufacturer Part Number: AXT650124
• Description: CONN HEADER F4S .4MM 50POS SMD
• Manufacturer: Panasonic Electric Works
• Series: F4Sr

Specifications of AXT650124

• Connector Type: Header, Center Strip Contacts
• Number Of Positions: 50
• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Mated Stacking Heights: 1mm
• Height Above Board: 0.033" (0.84mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Other names: 255-2399-2

(AXA4)
EMBOSSED TAPE AND REEL
• Tape dimensions
NOTES
1. Regarding the design of PC board
patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Regarding the socket mounting
1) When reflow soldering when the slider
is locked, heat will cause the slider to
deform and not work. Therefore, please
confirm that the slider lock is released
before mounting if you have inserted and
removed a card before soldering.
2) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
3. Soldering
1) Reflow soldering
• Screen-printing method is
recommended for cream solder printing.
• Use the recommended foot pattern for
cream solder printing (screen thickness:
0.12 mm).
• When applying the different thickness of
a screen, please consult us.
• Use the recommended reflow
temperature profile conditions shown on
the below.
• The temperature must be measured on
the surface of the PC board around the
connector terminals.
2) Hand soldering
Set the soldering tip to 300°C, and solder
for no more than 5 seconds.
196
Recommended reflow temperature
150 to 175°C
Temperature
260°C max.
Matsushita Electric Works, Ltd.
Emboss
carrier tape
profile conditions
Preheating
60 to 120 sec.
Top cover
tape
Peak temperature
200°C
Time
70 sec.
24.3±0.3
11.5
(1.75)
4. Cleaning after soldering
Inside the socket there is a slider section
and card detection contact/write
protection mechanism. If anything such
as flux remains inside after washing,
insertion and removal will be hampered
and contact will be faulty. Therefore, do
not use methods that involve submersion
when cleaning. (Partial cleaning of the
PCB and soldered terminals is possible.)
5. After PC board mounting
1) Warping of the PC board should be no
more than 0.03 mm for the entire
connector length.
2) When assembling PCBs or storing
them in block assemblies, make sure that
undue weight is not exerted on a stacked
socket.
3) Be sure not to allow external pressure
to act on sockets when assembling PCBs
or moving in block assemblies.
6. Handling single components
1) Make sure not to drop or allow parts to
fall from work bench
2) Be cautious when handling because
excessive force applied to the terminals
will cause deformation and loss of
terminal coplanarity.
3) Repeated bending of the terminals
may break them.
7. Card fitting
1) The socket’s molded part is partly
thinned to achieve the smaller and lighter
design. Therefore, carefully design the
target device’s housing to prevent the
excessively twisted card insertion/
removal and insertion in a slanted
direction.
2) The sockets are constructed to prevent
reverse card insertion. Caution is
required because repeated, mistaken
reverse insertion may damage the socket
and card.
(Unit: mm)
• Reel dimensions (Conforming to EIAJ ET-7200B)
(24.0±1)
Taping reel
3) When not soldered, be careful not to
insert and remove the socket's card.
Doing so will cause a decrease in
anchoring ability of the mated part and
loss of coplanarity.
4) Forcibly removing a fitted card may
degrade the card removal prevention
lock. To remove a card, be sure to push
the card in the insertion direction to
release the lock before pulling out the
card.
8. Device design
1) Contact failure may result if dust or dirt
enters the contact section. Please take
appropriate measures when designing
the device to prevent this from
happening, for example by adding a
cover.
2) To ensure smooth insertion and
removal of cards, please design the
chassis so that no force is applied to the
metal shell on top of the socket. If a force
is present that pushes down on the metal
shell, the card will be pressed, which
might prevent ejection.
3) Please provide a guide or similar to
keep the socket from having force applied
to it when inserting and removing.
9. Others
If you coat the PCB after soldering for
insulation and to prevent wear, make sure
that the coating does not adhere to the
socket.
Regarding general notes, please refer
to “NOTES FOR USING SMD TYPE
CONNECTORS”.
For other details, please verify with the
product specification sheets.
Top cover tape
Label
http://www.mew.co.jp/ac/e/
Tape
Emboss carrier tape
Cavity