FX11LA-68P-SV Hirose Electric Co Ltd, FX11LA-68P-SV Datasheet - Page 16
![CONN HEADER 68POS W/POSTS SMD](/photos/1/76/17610/fx11la-68p-sv_sml.jpg)
FX11LA-68P-SV
Manufacturer Part Number
FX11LA-68P-SV
Description
CONN HEADER 68POS W/POSTS SMD
Manufacturer
Hirose Electric Co Ltd
Series
FX11r
Datasheet
1.FX11LB-68P-SV21.pdf
(16 pages)
Specifications of FX11LA-68P-SV
Connector Type
Header, Outer Shroud Contacts
Number Of Positions
68
Pitch
0.020" (0.50mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide, Solder Retention
Contact Finish
Gold
Contact Finish Thickness
3.9µin (0.10µm)
Mated Stacking Heights
2mm
Height Above Board
0.075" (1.90mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*FX11LA-68P-SV
H2533
H2533
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FX11LA-68P-SV
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
Company:
Part Number:
FX11LA-68P-SV(21)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
1 927
Company:
Part Number:
FX11LA-68P-SV(21)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
125
Company:
Part Number:
FX11LA-68P-SV(22)
Manufacturer:
HIROSE
Quantity:
3 000
Company:
Part Number:
FX11LA-68P-SV(22)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
B
B
B
1. Allowable Creepage Dimensions at Time of Mating
2. Compatibility
3. Retension of Boards
4. Solder Repair
5. Miscellaneous
Recommended Temperature Profile
Washing Conditions
Connector Handling Precautions
Organic Solvent Washing
Water Type Washing
When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins.
Be careful that parts are not left with moisture remaining on them.
Washing Precautions
Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the
deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed.
[Stacking height : 2mm]
The effective coupling length of this product is 0.55 mm for
the signal portion and the ground portion. The creepage of
the header and receptacle at the time of mating should be
within 0.18 mm of the completely coupled condition.
2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other.
Avoid the support of boards by connectors alone and adopt a board locking measure that does not rely on the connectors.
Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair.
This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into
consideration prior to connector washing.
·
·
Note that excessive twisting while inserting or withdrawing connectors will cause damage.
The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance.
IPA(Isopropyl alcohol)
HCFC(Hydrochlorofluorocarbon)
Note : The temperature profile indicates the maximum temperature
260
240
220
200
180
160
140
of the connector surfaces at the highest point from the PCB
mounting surface.
0
Solvent
Preheating(150 to 200ç)
150ç
(90 to 120 sec.)
FX11 Series●0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
Room temperature washing Heated washing
200ç
Yes
Yes
(MAX250ç)
(60 sec. max.)
(220ç min)
Soldering
220ç
Time(sec.)
Yes
Yes
[Stacking height : 2.5mm, 3mm]
The effective coupling length of this product is 1 mm for the
signal portion and 0.7mm for the ground portion. The creepage
of the header and receptacle at the time of mating should be
within 0.4 mm of the completely coupled condition.
HRS test conditions
Test boardGlass epoxy 60mm∞35mm∞1.6mm thick
Solder method
Solder composition : Paste,96.5%Sn/ 3%Ag/ 0.5%Cu
Metal mask
Reflow cycles
The temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and
board size/thickness. Consult your solder paste and
equipment manufacturer for specific recommendations.
: Reflow
: 0.15mm thick
: 2 cycles
A237