DF17(2.0)-30DP-0.5V(57) Hirose Electric Co Ltd, DF17(2.0)-30DP-0.5V(57) Datasheet - Page 9
![CONN HEADER 30POS .5MM SMD W/FIT](/photos/1/73/17384/df17_2_0_30dp0_5v_51_sml.jpg)
DF17(2.0)-30DP-0.5V(57)
Manufacturer Part Number
DF17(2.0)-30DP-0.5V(57)
Description
CONN HEADER 30POS .5MM SMD W/FIT
Manufacturer
Hirose Electric Co Ltd
Series
DF17r
Datasheet
1.DF17A3.0-20DS-0.5V57.pdf
(9 pages)
Specifications of DF17(2.0)-30DP-0.5V(57)
Connector Type
Header, Outer Shroud Contacts
Number Of Positions
30
Pitch
0.020" (0.50mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide, Solder Retention
Contact Finish
Gold
Mated Stacking Heights
5mm, 6mm
Height Above Board
0.169" (4.30mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Contact Finish Thickness
-
Other names
H11129TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF17(2.0)-30DP-0.5V(57)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
3 000
A192
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
DF17 Series 0.5mm Pitch Board to Board Connector
1. Recommended
2. Recommended Manual
3. Recommended
4. Board Warp(SMT)
5. Cleaning Condition
6. Cautions
Precautions
Temperature Profile
(SMT)
Soldering Condition
(SMT)
Screen Thickness
(SMT)
Note1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that
Note2: The temperature profile indicates the board surface temperature at the point of contacts
Soldering iron temperature: 350 3 oldering time: Within 2 seconds
0.15mm
Max 0.02mm in the connector center area, based on the both connector edges
Refer to the "Nylon Connector Use Hand book".
The header is designed in a structure where contacts are exposed. Touching it with bare
hands would cause contact failure or electrostatic element damage.
Where no board is mounted, the insertion or extraction will cause damage or contact deformation.
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
Excessive scoop insertion or extraction may result in damage.
In the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.
The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
there is a return to normal temperature between the first and second cycle.
with the connector terminals.