NFR25H0002207JR500 Vishay, NFR25H0002207JR500 Datasheet - Page 7

• Manufacturer Part Number: NFR25H0002207JR500
• Description: RES .22 OHM .50W 5% MF FUSIBLE
• Manufacturer: Vishay
• Series: NFR25Hr

Specifications of NFR25H0002207JR500

• Temperature Coefficient: ±200ppm/°C
• Resistance (ohms): 0.22
• Power (watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Flame Proof, Fusible
• Tolerance: ±5%
• Size / Dimension: 0.098" Dia x 0.295" L (2.50mm x 7.50mm)
• Lead Style: Through Hole
• Package / Case: Axial
• Resistance In Ohms: 0.22
• Case: Axial
• Resistance: 0.22ohm
• Resistance Tolerance: ± 5%
• Power Rating: 500mW
• Resistor Element Material: Metal Film
• Resistor Case Style: Axial Leaded
• No. Of Pins: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Height: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 2322 207 23227; 232220723227; 5065FM0R220J12AFX; PPC.22BTR

NFR25, NFR25H
Vishay BCcomponents
APPLICATION INFORMATION
function of dissipated power at various lead lengths after mounting
TESTS AND REQUIREMENTES
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days).
The tests are carried out in accordance with IEC 60068-2-xx
test
mechanical robustness testing procedure for electronic
components” and under standard atmospheric conditions
according to IEC 60068-1, 5.3.
www.vishay.com
7
NFR25 Temperature rise (Δ ) at thr lead end (soldering point) as a
Minimum distance from resistor body to P.C.B. = 1 mm
ΔT
(K)
ΔT
(K)
100
method,
80
60
40
20
50
40
30
20
10
0
0
0
0
NFR25 Hot-spot temperature rise (Δ )
as a function of dissipated power
“Recommended
0.2
0.2
For technical questions, contact:
basic
0.4
0.4
Fusible, Non-Flammable Metal Film
15 mm
5 mm
10 mm
P (W)
P (W)
climatic
Leaded Resistors
0.6
0.6
and
[e-mail]
NFR25H Temperature rise (Δ ) at thr lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting
In the Test Procedures and Requirements table the
tests and requirements are listed with reference to the
relevant clauses of IEC 60115-1 and IEC 60068-2-xx test
methods. A short description of the test procedure is also
given. In some instances deviations from the IEC
recommendations were necessary for our method of
specifying. For inflammability requirements reference is
made to IEC 60115-1.
All soldering tests are performed with mildly activated flux.
Minimum distance from resistor body to P.C.B. = 1 mm
(K)
(K)
ΔT
ΔT
100
80
60
40
20
50
40
30
20
10
0
0
0
0
NFR25H Hot-spot temperature rise (Δ )
as a function of dissipated power
0.2
0.2
Document Number: 28737
0.4
0.4
Revision: 30-Mar-10
P (W)
P (W)
5 mm
10 mm
15 mm
0.6
0.6