TISP61089HDMR-S Bourns Inc., TISP61089HDMR-S Datasheet

SURGE PROT THYRIST 155V SLIC

TISP61089HDMR-S

Manufacturer Part Number
TISP61089HDMR-S
Description
SURGE PROT THYRIST 155V SLIC
Manufacturer
Bourns Inc.
Datasheets

Specifications of TISP61089HDMR-S

Package / Case
8-SOIC (3.9mm Width)
Voltage - Working
-48V
Voltage - Clamping
-57V
Technology
Mixed Technology
Number Of Circuits
2
Applications
SLIC
Breakover Current Ibo Max
7.7 A
Rated Repetitive Off-state Voltage Vdrm
170 V
Off-state Leakage Current @ Vdrm Idrm
0.005 mA
Holding Current (ih Max)
150 mA (Min)
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
TISP61089HDMR-STR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TISP61089HDMR-S
Manufacturer:
BOURNS/伯恩斯
Quantity:
20 000
Company:
Part Number:
TISP61089HDMR-S
Quantity:
905
Company:
Part Number:
TISP61089HDMR-S
Quantity:
2 000
T H Y R I S T O R S U R G E P R O T E C T O R S
Bourns Manufacturers Representatives
Corporate Distributor Product Managers
Americas Sales Team
Asia Sales Team
Europe Sales Team
April, 2009
PCN Tracking Number 48
Change from Gold to Copper Wire
In 2Q08, Bourns qualifi ed a change to the base metal composition of the wires used to bond over-
voltage protection chips to the package terminals of the 8-pin SOP (150 mil) package.
This notifi cation extends that qualifi cation to similar parts assembled in 8-pin SOP (210 mil EIAJ)
packages assembled at AIC Semiconductor SDN BHD, Kedah Darul Aman, Malaysia.
Products Affected by the Change:
Bourns® TISP® Overvoltage Protection Products assembled using the 8-pin SOP (210 mil EIAJ)
package. A list of products is provided on page 3 of this document.
Reason for the Change:
Copper wire is now a technically viable alternative to gold wire after several years’ development of
the wirebond process by mainstream bonder suppliers. Copper wire was introduced on 8-pin SOP
(150 mil) products shipped since September 2008. This change extends the range of products using
copper wire.
Product Labeling:
Product marking is unchanged.
Identifi cation of the Changed Product:
Bourns maintains traceability back to the source wafer lots and assembly sites for all products.
Implementation Date:
Assembly of product will begin July 2009. Deliveries to customers may occur from August 2009
onwards.
First Date Code with Copper Wire:
0827
Impact on Form, Fit, Function and Reliability:
The package outline dimensions will continue to meet Bourns’ current data sheet. Data sheet
product ratings and electrical characteristics are unaffected by the change. There is no impact on
form, fi t, function or reliability.
TSP0903

Related parts for TISP61089HDMR-S

TISP61089HDMR-S Summary of contents

Page 1

Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team ...

Page 2

PCN Tracking Number 48 - Change from Gold to Copper Wire April, 2009 Page Qualifi cation Plan/Results: See following page. Last Date of Manufacture of Existing Product: Product phase to copper wire may extend over a period ...

Page 3

... Die Shear >5 Kg Moisture MSL1 Sensitivity Samples subjected to HTRB, THB and T Cycle are preconditioned according to JESD22-A113 (260C). Stress Test Completion Date: June 2009 8-Pin SOP (210 mil) Part Numbers: TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S Standard Method SS/Acc MIL STD 750 1048 129/1 ...

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