MCP603T-E/ST Microchip Technology, MCP603T-E/ST Datasheet - Page 12
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MCP603T-E/ST
Manufacturer Part Number
MCP603T-E/ST
Description
IC OPAMP SNGL 2.7V 8TSSOP
Manufacturer
Microchip Technology
Datasheet
1.MCP601T-IOT.pdf
(34 pages)
Specifications of MCP603T-E/ST
Amplifier Type
General Purpose
Number Of Circuits
1
Output Type
Rail-to-Rail
Slew Rate
2.3 V/µs
Gain Bandwidth Product
2.8MHz
Current - Input Bias
1pA
Voltage - Input Offset
700µV
Current - Supply
230µA
Current - Output / Channel
22mA
Voltage - Supply, Single/dual (±)
2.7 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP603T-E/ST
Manufacturer:
MICROCHIP
Quantity:
12 000
MCP601/1R/2/3/4
4.0
The MCP601/1R/2/3/4 family of op amps are fabricated
on Microchip’s state-of-the-art CMOS process. They
are unity-gain stable and suitable for a wide range of
general purpose applications.
4.1
4.1.1
The MCP601/1R/2/3/4 op amp is designed to prevent
phase reversal when the input pins exceed the supply
voltages.
exceeding the supply voltage without any phase
reversal.
4.1.2
The ESD protection on the inputs can be depicted as
shown in
protect the input transistors, and to minimize input bias
current (I
when they try to go more than one diode drop below
V
above V
allow normal operation, and low enough to bypass
quick ESD events within the specified limits.
FIGURE 4-1:
Structures.
In order to prevent damage and/or improper operation
of these op amps, the circuit they are in must limit the
currents and voltages at the V
Absolute Maximum Ratings † at the beginning of
Section 1.0 “Electrical Characteristics”).
shows the recommended approach to protecting these
inputs. The internal ESD diodes prevent the input pins
(V
the resistors R
out of the input pins. Diodes D
input pins (V
V
implemented as shown, resistors R
the current through D
DS21314G-page 12
SS
DD
IN
. They also clamp any voltages that go too far
+ and V
, and dump any currents onto V
V
V
V
IN
DD
SS
+
DD
APPLICATIONS INFORMATION
Inputs
B
). The input ESD diodes clamp the inputs
Figure
; their breakdown voltage is high enough to
Figure 2-34
Bond
Bond
Bond
PHASE REVERSAL
INPUT VOLTAGE AND CURRENT
LIMITS
Pad
Pad
Pad
IN
IN
–) from going too far below ground, and
1
+ and V
and R
4-1. This structure was chosen to
1
2
Simplified Analog Input ESD
and D
limit the possible current drawn
IN
Stage
Input
shows
–) from going too far above
2
.
IN
1
+ and V
the
and D
1
and R
Bond
Pad
input
2
IN
prevent the
– pins (see
DD
2
Figure 4-2
V
also limit
. When
IN
voltage
–
FIGURE 4-2:
Inputs.
It is also possible to connect the diodes to the left of
resistors R
diodes D
mechanism. The resistors then serve as in-rush current
limiters; the DC current into the input pins (V
V
A significant amount of current can flow out of the
inputs when the common mode voltage (V
ground (V
high impedance may need to limit the useable voltage
range.
4.1.3
The Common Mode Input Voltage Range (V
includes ground in single-supply systems (V
does not include V
input behaves linearly as long as the Common Mode
Input Voltage (V
limits (V
Figure 4-3
same voltage as the inverting input, V
below V
FIGURE 4-3:
Limited V
IN
–) should be very small.
V
V
1
2
SS
DD
1
V
SS
–0.3V to V
OUT
–1.2V for correct operation.
shows a unity gain buffer. Since V
1
and D
IN
NORMAL OPERATION
); see
R
R
and R
R
R
1
2
Range.
D
1
2
>
>
CM
2
1
V
V
2
needs to be limited by some other
) is kept within the specified V
SS
SS
DD
+
–
Figure
. In this case, current through the
MCP60X
DD
D
. This means that the amplifier
Protecting the Analog
Unity Gain Buffer has a
– (minimum expected V
– (minimum expected V
2
–1.2V at +25°C).
© 2007 Microchip Technology Inc.
2-34. Applications that are
MCP60X
2 mA
2 mA
V
R
DD
3
OUT
V
OUT
must be kept
CM
OUT
) is below
SS
1
2
IN
)
)
+ and
), but
is the
CMR
CMR
)