OP97FPZ Analog Devices Inc, OP97FPZ Datasheet - Page 2

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OP97FPZ

Manufacturer Part Number
OP97FPZ
Description
IC OPAMP GP LP PREC 8DIP
Manufacturer
Analog Devices Inc
Type
General Purpose Amplifierr
Datasheets

Specifications of OP97FPZ

Slew Rate
0.2 V/µs
Amplifier Type
General Purpose
Number Of Circuits
1
-3db Bandwidth
900kHz
Current - Input Bias
30pA
Voltage - Input Offset
30µV
Current - Supply
380µA
Voltage - Supply, Single/dual (±)
±2 V ~ 20 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Op Amp Type
Low Power
No. Of Amplifiers
1
Bandwidth
900kHz
Supply Voltage Range
± 2V To ± 20V
Amplifier Case Style
DIP
No. Of Pins
8
Common Mode Rejection Ratio
132
Current, Input Bias
±30 pA
Current, Input Offset
30 pA
Current, Supply
380 μA
Impedance, Thermal
43 °C/W
Package Type
PDIP-8
Resistance, Input
30 Megohms
Temperature, Operating, Range
-40 to +85 °C
Voltage, Gain
2000 V/mV
Voltage, Input
±20 V
Voltage, Noise
17 nV/sqrt Hz
Voltage, Offset
30 μV
Voltage, Output, High
+14 V
Voltage, Output, Low
-14 V
Voltage, Supply
±15 V
Rail/rail I/o Type
No
Number Of Elements
1
Input Offset Voltage
75uV
Input Bias Current
150pA
Single Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (typ)
±15V
Voltage Gain In Db
126.02dB
Power Supply Rejection Ratio
110dB
Power Supply Requirement
Dual
Shut Down Feature
No
Single Supply Voltage (min)
Not RequiredV
Single Supply Voltage (max)
Not RequiredV
Dual Supply Voltage (min)
±2V
Dual Supply Voltage (max)
±20V
Technology
Bipolar
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
Current - Output / Channel
-
Gain Bandwidth Product
-
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
OP97FPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
OP97
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Connections ............................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 5
REVISION HISTORY
3/09—Rev. F to Rev. G
Changes to Figure 20 and Figure 23 ............................................... 9
Changes to Figure 26 and Figure 27 ............................................. 10
Updated Outline Dimensions ....................................................... 15
Changes to Ordering Guide .......................................................... 16
11/07—Rev. E to Rev. F
Updated Format .................................................................. Universal
Changes to Ordering Guide .......................................................... 16
07/03—Rev. D to Rev. E
Deleted H-08A .................................................................... Universal
Deleted Q-8 ......................................................................... Universal
Deleted E-20A ..................................................................... Universal
Deleted Die Characteristics ............................................................. 4
Deleted Wafer Test Limits ............................................................... 4
Updated TPC 14 ............................................................................... 5
Updated Outline Dimensions ....................................................... 10
Electrical Characteristics ............................................................. 3
Thermal Resistance ...................................................................... 5
Rev. G | Page 2 of 16
 
 
 
 
 
 
 
 
Typical Performance Characteristics ..............................................6
Application Information ................................................................ 11
AC Performance ............................................................................. 12
Guarding and Shielding ................................................................. 13
Outline Dimensions ....................................................................... 15
01/02—Rev. C to Rev. D
Edits to Absolute Maximum Ratings .............................................. 3
Edits to Ordering Guide ................................................................... 3
Deleted DICE Characteristics .......................................................... 3
Deleted Wafer Test Limits ................................................................ 3
Edits to Applications Information ................................................... 7
ESD Caution...................................................................................5
Ordering Guide .......................................................................... 16
 
 
 
 
 
 
 

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