LT6231CS8#PBF Linear Technology, LT6231CS8#PBF Datasheet - Page 21
![IC OP AMP DUAL LP 3.4MA 8-SOIC](/photos/12/47/124732/lt6231cs8_pbf_sml.jpg)
LT6231CS8#PBF
Manufacturer Part Number
LT6231CS8#PBF
Description
IC OP AMP DUAL LP 3.4MA 8-SOIC
Manufacturer
Linear Technology
Datasheet
1.LT6230CS6TRMPBF.pdf
(24 pages)
Specifications of LT6231CS8#PBF
Amplifier Type
General Purpose
Number Of Circuits
2
Output Type
Rail-to-Rail
Slew Rate
70 V/µs
Gain Bandwidth Product
215MHz
Current - Input Bias
5µA
Voltage - Input Offset
50µV
Current - Supply
3.3mA
Current - Output / Channel
30mA
Voltage - Supply, Single/dual (±)
3 V ~ 12.6 V, ±1.5 V ~ 6.3 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
package DescripTion
3.5 ±0.05
2.10 ±0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 ±0.05
(2 SIDES)
(NOTE 6)
0.25 ± 0.05
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
(Reference LTC DWG # 05-08-1698 Rev C)
2.38 ±0.05
8-Lead Plastic DFN (3mm × 3mm)
0.50
BSC
DD Package
3.00 ±0.10
0.75 ±0.05
0.70 ±0.05
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.125
TYP
4
5
2.38 ±0.10
LT6230/LT6230-10
8
1
0.50 BSC
LT6231/LT6232
0.40 ± 0.10
(DD8) DFN 0509 REV C
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