DF2338VFC25IV Renesas Electronics America, DF2338VFC25IV Datasheet - Page 789
DF2338VFC25IV
Manufacturer Part Number
DF2338VFC25IV
Description
MCU 3V 256K I-TEMP PB-FREE 144-Q
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2338VFC25IV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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19.6.1
When boot mode is used, the flash memory programming control program must be prepared in the
host beforehand. The channel 1 SCI to be used is set to asynchronous mode.
When a reset-start is executed after the H8S/2339 F-ZTAT chip’s pins have been set to boot mode,
the boot program built into the chip is started and the programming control program prepared in
the host is serially transmitted to the chip via the SCI. In the chip, the programming control
program received via the SCI is written into the programming control program area in on-chip
RAM. After the transfer is completed, control branches to the start address of the programming
control program area and the programming control program execution state is entered (flash
memory programming is performed).
The transferred programming control program must therefore include coding that follows the
programming algorithm given later.
The system configuration in boot mode is shown in figure 19.9, and the boot program mode
execution procedure in figure 19.10.
Boot Mode
Host
Figure 19.9 System Configuration in Boot Mode
Verify data transmission
Write data reception
Rev.4.00 Sep. 07, 2007 Page 757 of 1210
Chip
RxD1
TxD1
SCI1
Flash memory
On-chip RAM
REJ09B0245-0400
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