DF2338VFC25IV Renesas Electronics America, DF2338VFC25IV Datasheet - Page 75
DF2338VFC25IV
Manufacturer Part Number
DF2338VFC25IV
Description
MCU 3V 256K I-TEMP PB-FREE 144-Q
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2338VFC25IV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Table 2.3
Type
Data transfer
Instructions Classified by Function
Instruction
MOVFPE
MOVTPE
POP
PUSH
LDM
STM
MOV
Size *
B/W/L
B
B
W/L
W/L
L
L
1
Function
(EAs) → Rd, Rs → (Ead)
Moves data between two general registers or between a
general register and memory, or moves immediate data
to a general register.
Cannot be used in the H8S/2339 Group.
Cannot be used in the H8S/2339 Group.
@SP+ → Rn
Pops a register from the stack. POP.W Rn is identical to
MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L
@SP+, ERn.
Rn → @–SP
Pushes a register onto the stack. PUSH.W Rn is
identical to MOV.W Rn, @–SP. PUSH.L ERn is identical
to MOV.L ERn, @–SP.
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
Rn (register list) → @–SP
Pushes two or more general registers onto the stack.
Rev.4.00 Sep. 07, 2007 Page 43 of 1210
REJ09B0245-0400
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