PIC16C55-10E/SP Microchip Technology, PIC16C55-10E/SP Datasheet - Page 181
![IC MCU OTP 512X12 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16C55-10E/SP
Manufacturer Part Number
PIC16C55-10E/SP
Description
IC MCU OTP 512X12 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C55-10E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
20
Program Memory Size
768B (512 x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
B
c
p
n
Dimension Limits
E1
E
Units
A2
E1
A1
D
n
p
A
E
L
B
c
2
1
MIN
L
Preliminary
.068
.064
.002
.299
.396
.022
.004
.010
.201
D
0
0
0
INCHES
A1
NOM
.026
.073
.068
.006
.309
.207
.030
.007
.013
.402
A
28
4
5
5
MAX
.078
.072
.010
.319
.212
.407
.037
.010
.015
10
10
8
MIN
10.06
1.73
1.63
0.05
7.59
0.56
0.10
0.00
0.25
5.11
0
0
MILLIMETERS*
NOM
101.60
10.20
0.65
1.85
1.73
0.15
7.85
5.25
0.75
0.18
0.32
PIC16C5X
28
5
5
MAX
DS30453D-page 179
203.20
10.34
A2
1.98
1.83
0.25
8.10
5.38
0.94
0.25
0.38
10
10
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