PIC16C55-10E/SP Microchip Technology, PIC16C55-10E/SP Datasheet - Page 177
![IC MCU OTP 512X12 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16C55-10E/SP
Manufacturer Part Number
PIC16C55-10E/SP
Description
IC MCU OTP 512X12 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C55-10E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
20
Program Memory Size
768B (512 x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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28-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-079
n
eB
E1
E
Dimension Limits
§
2
1
D
Units
c
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
A1
A
MIN
1.395
Preliminary
.160
.140
.015
.595
.505
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
1.430
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
28
10
10
MAX
B
1.465
B1
.190
.160
.625
.560
.135
.015
.070
.022
.680
15
15
MIN
15.75
12.83
35.43
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
NOM
15.24
13.84
36.32
16.51
PIC16C5X
p
2.54
4.45
3.30
0.29
1.27
0.46
3.81
28
10
10
A2
DS30453D-page 175
MAX
15.88
14.22
17.27
37.21
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15
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