UPD70F3765GF-GAT-AX Renesas Electronics America, UPD70F3765GF-GAT-AX Datasheet - Page 1405
UPD70F3765GF-GAT-AX
Manufacturer Part Number
UPD70F3765GF-GAT-AX
Description
MCU 32BIT V850ES/JX3-H 128-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Hr
Datasheet
1.UPD70F3760GC-UEU-AX.pdf
(1512 pages)
Specifications of UPD70F3765GF-GAT-AX
Core Processor
RISC
Core Size
32-Bit
Speed
48MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART, USB
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD70F3765GF-GAT-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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V850ES/JG3-H, V850ES/JH3-H
32.2.4 Cautions
R01UH0042EJ0400 Rev.4.00
Sep 30, 2010
(1) Handling of device that was used for debugging
(2) When breaks cannot be executed
(3) When pseudo real-time RAM monitor (RRM) function and DMM function do not operate
(4) Standby release with pseudo RRM and DMM functions enabled
(5) Rewriting to peripheral I/O registers that requires a specific sequence, using DMM function
(6) Flash self programming
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication between MINICUBE2 and the target
• Standby mode is entered while standby release by a maskable interrupt is prohibited
• Mode for communication between MINICUBE2 and the target device is UARTC0, and the main clock has been
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication between MINICUBE2 and the target
• Standby mode is entered while standby release by a maskable interrupt is prohibited
• Mode for communication between MINICUBE2 and the target device is UARTC0, and the main clock has been
• Mode for communication between MINICUBE2 and the target device is UARTC0, and a clock different from the
• Mode for communication between MINICUBE2 and the target device is CSIF0 or CSIF3
• Mode for communication between MINICUBE2 and the target device is UARTC0, and the main clock has been
Do not mount a device that was used for debugging on a mass-produced product, because the flash memory was
rewritten during debugging and the number of rewrites of the flash memory cannot be guaranteed. Moreover, do
not embed the debug monitor program into mass-produced products.
Forced breaks cannot be executed if one of the following conditions is satisfied.
The pseudo RRM function and DMM function do not operate if one of the following conditions is satisfied.
The standby mode is released by the pseudo RRM function and DMM function if one of the following conditions is
satisfied.
Peripheral I/O registers that requires a specific sequence cannot be rewritten with the DMM function.
If a space where the debug monitor program is allocated is rewritten by flash self programming, the debugger can
no longer operate normally.
device, are masked
stopped
device, are masked
stopped
one specified in the debugger is used for communication
supplied.
CHAPTER 32 ON-CHIP DEBUG FUNCTION
Page 1405 of 1509
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