UPD70F3736GK-GAK-AX Renesas Electronics America, UPD70F3736GK-GAK-AX Datasheet - Page 52
UPD70F3736GK-GAK-AX
Manufacturer Part Number
UPD70F3736GK-GAK-AX
Description
MCU 32BIT V850ES/JX3-L 80-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet
1.UPD70F3736GK-GAK-AX.pdf
(830 pages)
Specifications of UPD70F3736GK-GAK-AX
Package / Case
*
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Speed
20MHz
Number Of I /o
66
Core Processor
RISC
Program Memory Type
FLASH
Ram Size
16K x 8
Program Memory Size
256KB (256K x 8)
Data Converters
A/D 8x10b, D/A 1x8b
Oscillator Type
Internal
Peripherals
DMA, LVD, PWM, WDT
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Core Size
32-Bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD70F3736GK-GAK-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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3.4.3
52
The areas shown below are reserved in the V850ES/JF3-L.
Notes 1. The V850ES/JF3-L has 18 address pins, so the external memory area appears as a repeated 256 KB
0 3 F F F F F F H
0 3 F F 0 0 0 0 H
0 3 F E F F F F H
0 1 0 0 0 0 0 0 H
0 0 F F F F F F H
0 0 2 0 0 0 0 0 H
0 0 1 F F F F F H
0 0 0 0 0 0 0 0 H
Memory map
2. Fetch access and read access to addresses 00000000H to 000FFFFFH is made to the internal ROM
image.
area. However, data write access to these addresses is made to the external memory area.
External memory area
Use prohibited
(14 MB)
Figure 3-2. Data Memory Map (Physical Addresses)
(64 KB)
(2 MB)
Preliminary User’s Manual U18952EJ1V0UD
Note 1
CHAPTER 3 CPU FUNCTION
On-chip peripheral I/O area
External memory area
Internal ROM area
Internal RAM area
(60 KB)
(1 MB)
(1 MB)
(4 KB)
Note 2
Note 1
0 3 F F F F F F H
0 3 F F F 0 0 0 H
0 3 F F E F F F H
0 3 F F 0 0 0 0 H
0 0 1 F F F F F H
0 0 1 0 0 0 0 0 H
0 0 0 F F F F F H
0 0 0 0 0 0 0 0 H
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