UPD78F0533AGB-GAH-AX Renesas Electronics America, UPD78F0533AGB-GAH-AX Datasheet - Page 916
UPD78F0533AGB-GAH-AX
Manufacturer Part Number
UPD78F0533AGB-GAH-AX
Description
MCU 8BIT 64-LQFP
Manufacturer
Renesas Electronics America
Series
78K0/Kx2r
Datasheet
1.UPD78F0500MC-5A4-A.pdf
(982 pages)
Specifications of UPD78F0533AGB-GAH-AX
Core Processor
78K/0
Core Size
8-Bit
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
55
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD78F0533AGB-GAH-AX
Manufacturer:
RENESAS
Quantity:
460
Company:
Part Number:
UPD78F0533AGB-GAH-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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78K0/Kx2
Note
Cautions
R01UH0008EJ0401 Rev.4.01
Jul 15, 2010
Infrared reflow
Wave soldering
Partial heating
Soldering Method
(3) 30-pin plastic SSOP (7.62 mm (300))
Table 35-2. Soldering Conditions of Expanded-specification products (
38-pin plastic SSOP (7.62 mm (300))
44-pin plastic LQFP (10x10)
52-pin plastic LQFP (10x10)
64-pin plastic LQFP (14x14)
64-pin plastic LQFP (12x12)
80-pin plastic LQFP (14x14)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
PD78F050xAMC-CAB-AX (x = 0 to 3), 78F0503DAMC-CAB-AX
PD78F050xAMCA-CAB-G (x = 0 to 3), 78F050xAMCA2-CAB-G (x = 0 to 3)
PD78F051xAMC-GAA-AX (x = 1 to 3), 78F0513DAMC-GAA-AX
PD78F051xAMCA-GAA-G (x = 1 to 3), 78F051xAMCA2-GAA-G (x = 1 to 3)
PD78F051xAGB-GAF-AX (x = 1 to 3), 78F0513DAGB-GAF-AX
PD78F05x1AGBA-GAF-G (x = 1 to 3), 78F051xAGBA2-GAF-G (x = 1 to 3)
PD78F052xAGB-GAG-AX (x = 1 to 7), 78F0527DAGB-GAG-AX
PD78F052xAGBA-GAG-G (x = 1 to 7), 78F052xAGBA2-GAG-G (x = 1 to 7)
PD78F053xAGC-GAL-AX (x = 1 to 7), 78F0537DAGC-GAL-AX
PD78F053xAGCA-GAL-G (x = 1 to 7), 78F053xAGCA2-GAL-G (x = 1 to 7)
PD78F053xAGK-GAJ-AX (x = 1 to 7), 78F0537DAGK-GAJ-AX
PD78F053xAGKA-GAJ-G (x = 1 to 7), 78F053xAGKA2-GAJ-G (x = 1 to 7)
PD78F054xAGC-GAD-G (x = 4 to 7), 78F0547DAGC-GAD-AX
PD78F054xAGCA-GAD-G (x = 4 to 7), 78F054xAGCA2-GAD-G (x = 4 to 7)
1. Do not use different soldering methods together (except for partial heating).
2. The
evaluation. Do not use the on-chip debug function in products designated for mass production,
because the guaranteed number of rewritable times of the flash memory may be exceeded when
this function is used, and product reliability therefore cannot be guaranteed. Renesas Electronics is
not liable for problems occurring when the on-chip debug function is used.
μ
PD78F05xxDA has an on-chip debug function, which is provided for development and
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature),
Exposure limit: 7 days
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 32 ELECTRICAL SPECIFICATIONS (A2) GRADE PRODUCTS
Note
(after that, prebake at 125°C for 10 to 72 hours)
Soldering Conditions
Note
(after that, prebake at 125°C for
μ
PD78F05xxA and 78F05xxDA) (2/2)
IR60-107-3
WS60-107-1
Condition Symbol
Recommended
−
916
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