DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 771
DF2552BR26DV
Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Specifications of DF2552BR26DV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Notes: 1. Transferring the data to the on-chip RAM enables this area to be used.
Item
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling Routine
Operation for Interrupt
Inhibit
Switching MATs by
FMATS
Operation for Writing
H'5A to FKEY
Operation for Settings
of Program Parameter
Execution of
Programming
Determination of
Program Result
Operation for Program
Error
Operation for FKEY
Clear
Switching MATs by
FMATS
2. Switching FMATS by a program in the on-chip RAM enables this area to be used.
On-Chip
RAM
Storable/Executable Area
User Boot
MAT
×*
×
×
×
×
×
×
×
×
×
2
User MAT
Rev. 6.00 Sep. 24, 2009 Page 723 of 928
User Boot
MAT
Section 20 Flash Memory
Selected MAT
Embedded
Program
Storage Area
REJ09B0099-0600
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